A wireless charging device includes a transmitter configured to transmit a power signal for wireless charging, a circuit board including at least one component configured to control an operation of the transmitter, a shielding plate configured to block an electrical interference between the transmitter and the circuit board, and a connector configured to penetrate through the circuit board and the shielding plate so as to electrically connect the transmitter with the at least one component.

Embodiments of this application are applied to the field of terminal technologies, and provide a PCB assembly and an electronic device, where the PCB assembly includes a PCB, a first conductor, a first battery, and a second battery. The PCB includes a groove area. The first battery and the second battery are disposed on different sides of the groove area. The first conductor is disposed in the groove area, and the first conductor is configured to connect the first battery and the second battery. That is, in the embodiments of this application, the first battery and the second battery are connected by using the first conductor in the groove area, which prevents a power cable connecting the first battery and the second battery from occupying an area on the PCB, thereby increasing an area in which other components can be installed on the PCB.

Embodiments of this application are applied to the field of terminal technologies, and provide a PCB assembly and an electronic device, where the PCB assembly includes a PCB, a first conductor, a first battery, and a second battery. The PCB includes a groove area. The first battery and the second battery are disposed on different sides of the groove area. The first conductor is disposed in the groove area, and the first conductor is configured to connect the first battery and the second battery. That is, in the embodiments of this application, the first battery and the second battery are connected by using the first conductor in the groove area, which prevents a power cable connecting the first battery and the second battery from occupying an area on the PCB, thereby increasing an area in which other components can be installed on the PCB.

Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.

Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.

In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.