A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

A circuit substrate (3) is provided with first and second rigid parts (11, 12) having six metal foil layers, and a thin flexible part (13) having two metal foil layers connecting the two rigid parts. A ground wiring (51) which is shaped like a wide strip is formed on the surface metal foil layer, and a plurality of inter-rigid-part wirings (55) are formed on the inner metal foil layer in parallel lines. Outer edges (51a) of the ground wiring (51) are positioned closer to side edges (13a) of the flexible part (13) than to the inter-rigid-part wirings (55). The ground wiring (51) protects the inter-rigid-part wirings (55) from cracks.

A multilayer substrate comprises: a stack having a plurality of insulating base materials; a first component arranged within the stack at a first level in a thickness direction of the stack; a second component arranged within the stack at a second level different from the first level and arranged so that, in a plan view, at least a portion of the second component overlaps with a portion of the first component; and a supplementary member arranged to at least partly exist in a range, in a thickness direction, as high as or higher than a lower end of the second component and as high as or lower than an upper end of the second component, and in a plan view, within a region of a projected area of the first component not overlapped with the second component, the supplementary member having a rigidness higher than the insulating base materials.

A high-current contact device includes a first contact element transmitting electrical energy, a circuit carrier, a first data contact transmitting data, and a data interface. The first contact element extends through the circuit carrier along a mating axis at a feedthrough. A conductor track of the circuit carrier electrically connects the first data contact to the data interface. A carrier of the circuit carrier is injection-molded and mechanically supports the first data contact, the conductor track, and the data interface.

A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

A flexible electronic device (SED) that can conform to a three-dimensional structure, and methods for manufacturing the SED, are disclosed herein. The SED comprises a flexible substrate which is modified in accordance with a folding pattern. The flexible substrate can be folded or unfolded along crease lines of the folding pattern, and the largest deformations of the substrate are localized at the crease lines. Various functional components of the SED are positioned on rigid regions of the substrate defined by the folding pattern. Such that the various functional components are protected from large deformations due to a folding or unfolding process, ensuring good performance of the functional components.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

An electro-optical apparatus includes an electro-optical panel having a first end portion, a first connector that is flexible, and a reinforcement member on the first connector. The first connector has a second end portion and a third end portion opposite to the second end portion. The second end portion is connected to the first end portion. The first connector has a first surface connected to the electro-optical panel, and a second surface opposite to the first surface. The reinforcement member is located on the first surface, and extends from an end surface at the first end portion of the electro-optical panel to the third end portion. The first connector has first and second side edges, at least one of which has a first cutout depressed inward. The first and second side edges connect the second and third end portions to each other.

An electronic circuit may include an elastomeric substrate with an electronic die attached to the elastomer substrate at a first substrate area and one or more meander traces electrically coupled to the electronic die and encapsulated in the elastomer substrate at a second substrate area that is adjacent to the first substrate area. An inelastic, non-electronic, structural brace may be attached to the elastomeric substrate in the first substrate area.