An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.

An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.

A system includes a top printed circuit (PCB) including an array of contact pads, a bottom PCB including an array of contact pads, at least one interposer positioned between the top and bottom PCBs, including: an array of top connectors configured to contact the array of contact pads of the top PCB; an array of bottom connectors configured to contact the array of contact pads of the bottom PCB; and interconnections configured to electrically connect the top connectors and the bottom connectors, at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB; and at least one fastener of the top PCB and the bottom PCB. The system further includes fasteners configured to press the top PCB, the interposer, the bottom PCB, and the spacer layer together.

An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.

An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

An adapter for connecting a PCI board and a PCIe board to a control board installed in a slot of an electronic device, includes a base plate. The base plate includes a holding structure configured to selectively hold a PCI relay board and a PCIe relay board, and an attachment structure configured to selectively attach a PCI bracket and a PCIe bracket.

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

An apparatus is described. The apparatus includes a module having a connector along a center axis of the module. The module further includes a first set of semiconductor chips disposed in a first region of the module that resides between a first edge of the module and a first side of the connector, and, a second set of semiconductor chips disposed in a second region of the module that resides between a second opposite edge of the module and a second opposite side of the connector. A through hole does not exist between the first set of semiconductor chips and the first side of the connector nor between the second set of semiconductor chips and the second side of the connector. The module further includes a first through hole between a third edge of the connector and a third edge of the module and a second through hole between a fourth edge of the connector and a fourth edge of the module. The first and second through holes are to align with first and second studs that are to support a leaf spring when the leaf spring is bowed to press the connector into a printed circuit board.

A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.