A device for fixing a camera module, includes

a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.

A capacitor loop substrate assembly may include a substrate with a loop shape, one or more capacitors or other electronic components on the substrate, and an opening in the substrate to allow the capacitor loop substrate assembly to be coupled to an integrated circuit package, such as a package including a die. Interconnects and/or contacts for interconnects may be formed in an integrated circuit package to couple the capacitor loop substrate assembly to the integrated circuit package.

An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.

These embodiments relates to an electric control unit including a circuit board that is provided in a housing, a damper including a frame member that is formed in correspondence with a frame of the circuit board and is combined with an upper face of the circuit board and a damping member combined with an upper face of the frame member, and a housing cover that is supported at the damping member and is combined with the housing and prevent generation of noise due to vibrations of the housing cover.

A tamper resistance wall structure on a circuit board includes a wall body formed of a laminated board, and a tamper detection wiring provided in the wall body. An outer through hole is provided in an outer surface of the wall body, which is a side surface away from a protective area on the circuit board, and is formed perpendicular to a longitudinal direction of the outer surface and perpendicular to the circuit board. An inner through hole is provided in an inner surface of the wall body, which is a side surface close to the protective area on the circuit board, and is formed perpendicular to a longitudinal direction of the inner surface and perpendicular to the circuit board. A recess is formed on the inner surface, and the inner through hole is formed in the recess and is a part of the tamper detection wiring.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.

A printed circuit board enclosure employs a box having an open base and opposing side plates. Securing tabs extend laterally from the side plates. The securing tabs have bottom surfaces that are coplanar extensions of a bottom surface of the box and are configured to be attached to the main circuit board. A cover is received on the box. The cover is configured to close the open top of the box. The cover has side flanges extending downwardly from a top plate with mating tabs extending laterally from the side flanges aligned with the securing tabs.