Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability. A method includes transferring solder paste on to a bottom PCB and forming a bottom PCBA by placing SMT components on the bottom PCB. A middle PCB is stacked on the bottom PCBA and solder paste is transferred on to the middle PCB. A top PCB is stacked on the middle PCB and solder paste is transferred on to the top PCB. SMT components are placed on the top PCB to form a stacked assembly. The stacked assembly is reflowed in a single reflow so that all solder paste simultaneously or nearly simultaneously melts to bond SMT components to respective PCB boards and to bond respective PCBs to each other.

A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.

A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

A circuit structure includes a circuit board having a connection opening. An electronic component is mounted on a top surface side of the circuit board, and a plurality of bus bars are disposed on a bottom surface side thereof, the electronic component includes a plurality of connection terminals, and a connection terminal of the plurality of connection terminals is connected to a bus bar on the bottom surface side of the circuit board via the connection opening. The circuit structure includes a heat dissipation member provided on a side of the plurality of bus bars opposite to a surface on which the electronic component is connected, an insulating heat-transfer material having insulating properties and heat transferring properties, and a restricting member is provided between the plurality of bus bars and the heat dissipation member, and restricts movement of the insulating heat-transfer material caused by an increase in temperature.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

An electrical connector assembly includes an insulative housing, a plurality of contacts retained to the housing, a metallic frame/fastener surrounding the housing, a retainer/clip positioned upon the housing and retaining a CPU thereon. The metallic frame includes four positioning posts at four corners, and the retainer includes a frame part to form a receiving space for receiving the CPU therein, and further includes four metallic retaining supports embedded within four corners of the retainer corresponding to the four positioning posts so as to allow the four positioning posts to extending therethrough in the vertical direction.

A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.