A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.

A touch device is provided. The touch device includes a substrate, a light-emitting element, a light-shielding member, a sensing board, and a light-passing board. The light-emitting element is disposed on the substrate. The light-shielding member is disposed on the substrate, wherein the light-shielding member has a first opening, and the light-emitting element is located in the first opening. The sensing board is disposed on the light-shielding member, and is electrically connected to the substrate. The sensing board has a second opening, and the first opening and the second opening overlap. The light-passing board is disposed on the sensing board, and covers the first opening and the second opening.

A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor. The first substrate includes a mount area and a peripheral area. The second substrate is located in the peripheral area to align with an outer edge of the first substrate and surrounds the mount area. The signal line extends on an upper surface of the second substrate from an inner edge to an outer edge of the second substrate. The groove extends on a side surface of the first substrate from a lower surface to an upper surface of the first substrate. The feedthrough conductor is inside the second substrate and connected to the signal line. The side conductor is on an inner surface of the groove and electrically connected to the feedthrough conductor. The groove is inward from the outer edge of the second substrate.

An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

A chip package assembly and method for fabricating the same are provided which utilize a composite stiffener selected to provide excellent resistance to warpage without detrimentally imposing excessive stress on a package substrate of the package assembly. In one example, the chip package assembly includes an integrated circuit die stacked on a top surface of a package substrate, and a composite stiffener coupled to a first edge of the package substrate. The composite stiffener includes a first stiffener member and a second stiffener member. The first stiffener member has a bottom surface bonded to the top surface of the package substrate. The second stiffener member is disposed over the first stiffener member. The second stiffener member has a bottom surface bonded to the top surface of the package substrate. The second stiffener member has a Young's modulus that is less than a Young's modulus of the first stiffener member.

A circuit board manufacturing method which includes inserting either a first claw or a second claw through a notch formed by notching an edge of a hole of a wiring board. The first claw and the second claw project outward from a wall portion of a cover member. The cover member is held on the wiring board, by sliding the cover member relative to the wiring board to position the edge of the hole between the first claw and the second claw provided on a surface of the wall portion identical to a surface on which the first claw is provided. The cover member is detached from the wiring board, by sliding the cover member relative to the wiring board to shift the first claw from the component mounting surface side to a soldering surface side with the first claw passing through the notch.

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).