An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element. The sealing ring can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery of the first circuit board element and flows into recesses of the microstructures and, after the curing, forms the form-closed and sealing connection between the two circuit board elements and the sealing ring thereby formed.

An example implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.

An adapter for connecting a PCI board and a PCIe board to a control board installed in a slot of an electronic device, includes a base plate. The base plate includes a holding structure configured to selectively hold a PCI relay board and a PCIe relay board, and an attachment structure configured to selectively attach a PCI bracket and a PCIe bracket.

An endoscope device, a flexible printed circuit board assembly and a flexible printed circuit board thereof are provided. The flexible printed circuit board includes a sensing module carrier portion, a first body portion, a second body portion, a third body portion, a fourth body portion and a light-emitting element carrier portion. The first body portion and the second body portion are respectively located on opposite sides of the sensing module carrying portion. The fourth body portion is connected with the second body portion, and the third body portion and the fourth body portion are respectively located on opposite sides of the sensing module carrying portion. The light-emitting element carrier portion includes a first carrier side portion connected to the third body portion and a second carrier side portion connected to the third body portion. The first and the second carrier side portions are separated from each other.

A bridge array for connecting electronic components within a housing includes an array bracket and a plurality of connection modules coupled to the array bracket. Each connection module includes a first electrical connector configured to receive a first electronic component, and a second electrical connector configured to receive a second electronic component; thereby physically and electrically connecting the first electronic component and the second electronic component of each connection module. The array bracket includes a first electrical port electrically connected to the first electrical connector of each connection module. The first electrical port provides a common connection to the first electronic component of each connection module. The array bracket includes a second electrical port electrically connected to the second electrical connector of each connection module. The second electrical port provides a common connection to the second electronic component of each connection module.