A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

A method includes attaching an integrated circuit chip module substrate to a printed circuit board (PCB). First region(s) of a bottom surface of the module include electrical contacts to the board, and second region(s) of the bottom surface of the module lack such contacts. Mechanical structures are assembled into the second regions. These structures allow lateral motion of the module relative to the board, and are sized and placed to inhibit bending of the second regions of the module towards the board under application of a vertical force on a top surface of the module. A package for an integrated circuit may be assembled using the method.

A printing device includes a frame, and an electronic circuit-board unit attached to the frame. The electronic circuit-board unit includes: a holder including a holding portion; a first substrate held to a first surface of the holder; a second substrate held to a second surface of the holder and attached to the frame; an electronic component; and a harness electrically connected to the electronic component. The holder has: a first region overlapped with the first substrate in a plan view; and a second region offset from the first region in the plan view. At least one of the electronic component and the harness is held by the holding portion.

A circuit board mounting support for supporting a first electronic circuit integration includes a bearing member. The first electronic circuit integration includes a circuit board, an electronic component engaged with a first surface of the circuit board, and multiple legs for engaging with the bearing member. The circuit board has a mounting area for mounting the electronic component and a second surface opposite to the first surface. The bearing member includes a groove and an engaging portion connected to a peripheral edge of the groove. A corresponding area is defined on the bearing member and corresponds to the mounting area of the circuit board. When the bearing member is engaged with the circuit board, an opening of the groove and the engaging portion face the second surface. A junction that each of the legs is engaged with the bearing member is located out of the corresponding area.

Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

This disclosure describes an electronic component with a package body which comprises a set of sidewalls and a bottom wall. One or more chip mounting elements extend into the space within the package from the inner surface of at least one sidewall, and at least one electronic chip is attached to the chip mounting elements. The electronic component also comprises one or more stiffening elements which extend inside the space within the package from the inner surface of one of the sidewalls to the outer surface of the bottom wall. These stiffening elements are separated from the one or more chip mounting elements inside the enclosed inner space.

A semiconductor device includes a semiconductor element, a circuit board, metal wires, and an expanding member. The circuit board has an upper surface and a lower surface opposite the upper surface. The metal wires arc formed on at least one of the upper surface and the lower surface. At least two connection terminals are formed in a terminal formation surface of the semiconductor element which is disposed so as to face the upper surface of the circuit board. The expanding member is fixed to the terminal formation surface of the semiconductor element, has a larger coefficient of linear thermal expansion than the semiconductor element, and has a size larger than the interval between adjacent two of the at least two connection terminals.

An electrical connector used for connecting an chip module to a printed circuit board includes an insulating housing, a number of terminals and a cover. The insulating housing includes a body portion. The terminals are insert molded in the body portion. The body portion includes an upper face and a lower face. Each of the terminals includes a first soldering portion extending upwardly beyond the upper face and a second soldering portion extending downwardly beyond the lower face. The cover covers the insulating housing. The electrical connector has a simple structure and a simple manufacturing process.