An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

The power semiconductor module includes a power semiconductor assembly and a heat transfer member. The power semiconductor assembly includes a circuit board and a case. The circuit board includes an insulating substrate. The second attachment surface to which the heat transfer member is attached is recessed from the first attachment surface to which the heat sink is attached. The maximum recessed distance of the second attachment surface from the first attachment surface is smaller than the original thickness of the heat transfer member, and is greater than the lower limit thickness of the heat transfer member.

The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.

An electronic control module includes: a first board having an upper surface on which electronic components are mounted; a second board disposed on an upper surface side of the first board with an interval therebetween and having an upper surface on which electronic components are mounted; and a tubular bracket provided between the first board and the second board and defining a closed space between the first board and the second board.

A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.