Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.

A protector is configured to protect a belt-like flexible board where a wiring pattern is provided. The protector includes a first accommodation portion configured to accommodate the flexible board so as to be slidable in a length direction of the flexible board, a second accommodation portion configured to accommodate the flexible board in a position different from the first accommodation portion in the length direction, and a bendable coupling portion that connects between the first accommodation portion and the second accommodation portion. The coupling portion is structured so that under a condition where the coupling portion is curved, deformation of the flexible board in a direction away from the coupling portion is allowed when the flexible board is slid in the length direction with respect to the first accommodation portion.

Provided is a frame assembly for fixing a plurality of stacked battery cells. The frame assembly may include: a frame including an upper surface, a first side surface connected to a first end of the upper surface and a second side surface connected to a second end of the upper surface, the frame being configured to enclose the plurality of battery cells; a plurality of first bus bars disposed on the first side surface; a plurality of second bus bars disposed on the second side surface; and a flexible printed circuit board disposed along the upper surface, the first side surface, and the second side surface of the frame, the flexible printed circuit board being configured to sense the plurality of battery cells.

A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.

According to certain embodiments, an electronic device comprising a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing; a battery disposed between the first printed circuit board and the second printed circuit board; a connection member disposed along one side surface of the battery, and electrically connecting the first printed circuit board and the second printed circuit board; a protection circuit module disposed along the one side surface of the battery and over the connection member; and a first flexible printed circuit board disposed adjacent to the protection circuit module and connected with the first printed circuit board or the second printed circuit board.

An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.