In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

An electronic device is disclosed. The electronic device includes: a flexible printed circuit board configured to connect a first printed circuit board and a second printed circuit board and including a rigid area and a flexible area, and a guide at least partially coupled to the rigid area, and located inside the flexible printed circuit board.

The flexible printed circuit assembly includes a flexible printed circuit and a control structure. The control structure includes a transmission member and two reels arranged on the transmission member at an interval. The flexible printed circuit passes between the two reels. The transmission member is configured to drive the two reels to rotate, so that the flexible printed circuit is wound on entire peripheral sides of the two reels. Alternatively, the control structure includes a transmission member, a guide shaft, and a connecting member. The guide shaft is located on a side of the flexible printed circuit. The connecting member has one end arranged on the transmission member and another end connected to the guide shaft. The transmission member is configured to drive the connecting member to drive the guide shaft to move, and the guide shaft is configured to drive the flexible printed circuit to bend.

A printed circuit board (PCB) includes a PCB substrate comprising a conductive trace; a dock opening formed from a cutout extending through the PCB substrate; a securing rail coupled to the PCB substrate along at least one edge of the dock opening, the securing rail comprising at least one attachment point; at least one connector coupled to the PCB substrate; and a locking member coupleable to the securing rail at the at least one attachment point.

An optical device (1) includes a feedthrough substrate (2). The feedthrough substrate (2) is connected to one end of the flexible substrate (3). A cap (4) covers the one end of the flexible substrate (3). The feedthrough substrate (2) includes a second wiring pattern (8) joined to the first wiring pattern (12) at the one end of the flexible substrate (3) by solder (13). The guide slope (15a, 15b) is provided on an inner surface of the cap (4).

A storage module double-layer positioning device set includes a storage module and two positioning devices arranged on two sides of the circuit board of the storage module in a staggered manner. Each positioning device includes a base with an accommodating chamber, two slideways, two side guide plates, a limiting groove, a blocking wall, a positioning block and a positioning unit; a retaining member having a horizontal portion with a pushing portion and an operating portion, a vertical portion extending inserted into the accommodating chamber, a connecting plate connected to the vertical portion, and two positioning blocks respectively inserted into the limiting grooves of the base to form positioning; an elastic member set in the accommodating chamber and stopped between the vertical portion and the blocking wall; and a sliding shaft running through the connecting plate and the elastic member with two opposite ends thereof respectively positioned in the two slideways.

According to certain embodiments, an electronic device comprising a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing; a battery disposed between the first printed circuit board and the second printed circuit board; a connection member disposed along one side surface of the battery, and electrically connecting the first printed circuit board and the second printed circuit board; a protection circuit module disposed along the one side surface of the battery and over the connection member; and a first flexible printed circuit board disposed adjacent to the protection circuit module and connected with the first printed circuit board or the second printed circuit board.

A heat dissipation module is adapted to be installed on a motherboard having a connector. The connector is adapted to connect an interface card. The heat dissipation module includes a base assembly adapted to be fixed on the motherboard, a heat dissipation member, and a fastening member. The base assembly is an integrated base body having opposite first and second ends. The first end is adjacent to the connector and has a fixing portion. The second end has a fastening portion. The interface card is adapted to be installed between the first end and the second end. The heat dissipation member has opposite third and fourth ends. The third end is adapted to be detachably connected to the fixing portion. The fastening member is pivoted on the fourth end and adapted to be detachably connected to the fastening portion.

An apparatus for manufacturing catheter electrode-fPCB assemblies, the apparatus includes a tray, a heat source, and a sleeve molding station. The tray is configured to (i) receive an electrode in a designated first recess in a predefined layout of the recess, wherein the electrode is ring-shaped and (ii) receive a flexible printed circuit board (fPCB) strip in a second recess configured to enable to thread the fPCB strip via the electrode to a predefined position of the strip such that a pad patterned on the fPCB strip is aligned with the electrode. The heat source is configured to apply heat for soldering the pad to an inner surface of the electrode. The sleeve molding station is configured to mold an encapsulating sleeve over the electrode-fPCB assembly, while keeping a proximal end of the strip and at least a portion of the electrode exposed.