A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.

The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

A vehicle headlamp module, including an electrical circuit arrangement for controlling at least one function of a vehicle headlamp, and a housing for at least partially accommodating the electrical circuit arrangement, wherein the housing at least in certain sections has a metallic electrically conductive shielding surface facing the circuit arrangement for electromagnetically shielding the circuit arrangement. The electrical circuit arrangement has at least one contact-sensitive surface section that is constructed in a substantially planar manner, is free from electrical components arranged thereon, and faces a planar section of the shielding surface of the housing. Electrical conductor tracks and/or contacts run along the contact-sensitive surface section, wherein a number of cured electrically non-conductive adhesive dots is arranged on the contact-sensitive surface section that is constructed in a substantially planar manner, which protrude from the contact-sensitive surface section in the direction of the planar section of the shielding surface of the housing to ensure a minimum spacing between the contact-sensitive surface section and the planar section of the shielding surface of the housing.

An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween.

A printed circuit board (PCB) system includes an integrated circuit (IC) package having a main IC chip that is electrically coupled to a top surface of a package substrate. A first printed circuit board (PCB) is electrically coupled to first contact structures on a bottom surface of the package substrate. A heat dissipation member is coupled to the main IC chip. A memory module is configured to electrically couple, via an interposer, with second contact structures on a top surface of the package substrate while the heat dissipation member dissipates heat from the main IC chip away from one or more memory IC chips on the memory module. The interposer is configured to electrically couple the second contact structures of the IC package with the memory module while the heat dissipation member dissipates heat from the main IC chip away from the one or more memory IC chips.

What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

A multiple board standoff for interconnecting a plurality of electronic boards, such as printed circuit boards, having at least one keyhole slot. The standoff comprises a plurality of major diameter portions, a plurality of minor diameter portions each disposed between two of the plurality of major diameter portions, and a plurality of abutment surfaces each transversely extending from one of the major diameter portions to one of the minor diameter portions. At least one of the minor diameter portions is configured to be inserted into the keyhole slot when the standoff is in a first orientation with respect to the electronic board and being retained within the keyhole slot when the standoff is in a second orientation with respect to the electronic board.

Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.