A fastener includes a base having a joint plate extended therefrom toward a first direction, a joint plate extended from the joint plate toward a second direction and configured to secure to an electronic base board, and a fastening member protruded thereon toward a third direction. The fastener includes an elastic compressive unit connected to the joint plate and including a pushing part configured to abut with a circuit board downwardly rotated. Subject to the stress in the first direction and applied by the circuit board, the pushing part is moved back and the elastically-compressive unit is compressed to make the circuit board rotate to the bottom side of the pushing part, and an edge of the circuit board can be inserted into and abutted thereon the fastening member, and the circuit board is accommodated in a fastening space formed on the outside of the fastening member.

A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

A mezzanine power pin includes a dual layer pin body extending between a pin top having an upper power interface and a pin bottom having a lower power interface. The dual layer pin body has a base metal core and an outer metal oxide layer combined with the base metal core defining an outermost layer of the dual layer pin body. The mezzanine power pin includes an upper fastener coupled to the pin top to mechanically and electrically connect an upper component to the upper power interface. The mezzanine power pin includes a lower fastener coupled to the pin bottom to mechanically and electrically connect a lower component to the lower power interface. The base metal core is configured to electrically connect the upper component and the lower component through the base metal core.

A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.

The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

A vehicle headlamp module, including an electrical circuit arrangement for controlling at least one function of a vehicle headlamp, and a housing for at least partially accommodating the electrical circuit arrangement, wherein the housing at least in certain sections has a metallic electrically conductive shielding surface facing the circuit arrangement for electromagnetically shielding the circuit arrangement. The electrical circuit arrangement has at least one contact-sensitive surface section that is constructed in a substantially planar manner, is free from electrical components arranged thereon, and faces a planar section of the shielding surface of the housing. Electrical conductor tracks and/or contacts run along the contact-sensitive surface section, wherein a number of cured electrically non-conductive adhesive dots is arranged on the contact-sensitive surface section that is constructed in a substantially planar manner, which protrude from the contact-sensitive surface section in the direction of the planar section of the shielding surface of the housing to ensure a minimum spacing between the contact-sensitive surface section and the planar section of the shielding surface of the housing.