A multilayer ceramic electronic component includes a ceramic body having at least one rounded corner, and including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, and first and second external electrodes, electrically connected to corresponding internal electrodes, respectively. The first and second external electrodes include first and second base electrode layers, each having at least a portion in contact with first and second external surfaces of the ceramic body, first and second conductive resin layers disposed to cover the first and second base electrode layers, respectively, and first and second plating layers disposed to cover the first and second conductive resin layers, respectively.

A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.

A battery system that is formed from a plurality of battery cells arranged on a flexible printed circuit card, where the flexible printed circuit card is folded along an axis forming an upper and lower portion of the flexible circuit card. A visco-elastic shock-absorbing member installed between the upper and lower portion of the flexible circuit card. Each battery cell may also have a visco-elastic shock-absorbing member that is attached individually to each battery cell of the plurality of battery cells.

An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.

An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04t/T0.80.

A vibration isolating thermally conductive connector includes a first thermally conductive element configured to draw heat from a heat source, a second thermally conductive element separated from the first thermally conductive element, and a flexible seal connected with the first and second thermally conductive elements and defining an enclosed cavity between the elements. The enclosed cavity contains a thermally conductive liquid, and allows limited movement of the second and first thermally conductive elements with respect to each other while maintaining thermal connection.

An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.

An airbag control system includes a printed circuit board, a switched-mode power supply having a molded inductor electrically mounted on the printed circuit board, and at least one Micro-Electro-Mechanical System (MEMS) sensor electrically mounted on the printed circuit board.

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrode disposed on first and second external surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively, and an interposer including an insulating body having first and second recess regions and first and second terminal electrodes. The first and second recess regions are disposed in a central region of the insulating body in a width direction. A/B is within a range from 0.14 or more to 0.51 or less, where A is an area of each of the first and second recess regions, viewed in a cross-section in length and width directions, and B is an area of each of the first and second terminal electrodes, viewed in the cross-section in the length and width directions.

An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.