An apparatus includes a body having one or more protrusions from a surface of the body, wherein each of the protrusions has a corresponding coupling positioned at a corresponding end of each of the protrusions. The apparatus further includes one or more mechanical energy storage components, wherein each of the one or more mechanical energy storage components provide a force that is greater than an external force exerted on the apparatus.

A circuit board having multiple degrees of freedom, comprises a flat board and a conductive and flexible unit disposed on the flat board. The conductive and flexible unit comprises: an inner support plate, an outer support plate, and at least one flexible connector; a hollow portion is provided on the outer support plate; the inner support plate and the flexible connector are disposed in the hollow portion; the inner and the outer support plates are connected by the flexible connector; the flexible connector comprises an outer connecting portion, an inner connecting portion corresponding to the outer connecting portion, and an extension located between the outer connecting portion and the inner connecting portion. The circuit board has a simple and compact structure; the production efficiency is high; costs are low; a multi-axis flexible anti-shaking effect can be achieved without folding a flexible structure; the resilience performance is good.

A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

In general, the subject matter described in this disclosure can be embodied in methods, systems, and program products for receiving an indication that a vehicle has begun accelerating from a stationary state. A computing system sets, in response to having received the indication that the vehicle has begun accelerating from the stationary state, an orientation value generated using a gyroscope to a default orientation value. The computing system repeatedly updates the orientation value generated using the gyroscope, based on changes in gyroscope orientation that occurred after the computing system set the orientation value to the default orientation value. The computing system determines that the updated orientation value satisfies criteria that indicates that the vehicle is likely to encounter or has encountered a dangerous situation. The computing system outputs a signal to cause the vehicle to employ a safety measure.

A seat plate assembly for fixing a capacitor on a circuit board, including a base plate, a first guard plate, a second guard plate, a third guard plate, a fourth guard plate, a first reinforcing rib and a second reinforcing rib. The first guard plate, the second guard plate, the third guard plate and the fourth guard plate are provided spaced apart on an upper end surface of the base plate in sequence. The first reinforcing rib is configured to connect the first guard plate with the second guard plate. The second reinforcing rib is configured to connect the third guard plate with the fourth guard plate.

In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole.

A supporting-terminal-equipped capacitor chip includes a capacitor chip, and first and second supporting terminals that are electrically conductive and hold the capacitor chip therebetween. A portion of the capacitor chip other than a first connection portion and the first supporting terminal are separated from each other. A portion of the capacitor chip other than a second connection portion and the second supporting terminal are separated from each other. The first connection portion is located on the first main surface adjacent to a first end surface. The second connection portion is located on the first main surface adjacent to a second end surface.

A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

A multilayer ceramic capacitor may include: ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, external electrodes including a connecting portion and band portion, terminal electrodes including upper and lower horizontal portion and vertical portion connecting end portion of the upper and lower horizontal portion and the conductive adhesive layers disposed to the upper surface of the band portion and upper horizontal portion.