A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes each at end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and spaced apart from each other in a length direction connecting the two end surfaces and intersecting the lamination direction. The external electrodes each include a bulge portion protruding in the lamination direction on the surface of the capacitor main body. The interposers each include a recess portion on each of the end surfaces, and in a cross section extending in the lamination direction and the length direction and passing through a center in a width direction. The bulge portion is closer to the end surface in the length direction than the recess portion.

An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.

Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.

A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

An implantable medical device may include a plurality of electrical components connected to form operational circuitry, a canister shaped for housing the operational circuitry, and a dampening layer configured to reduce internal motion between the operational circuitry and at least one of a plurality of additional component within the canister, the dampening layer selectively disposed over the operational circuitry but not over the at least one additional component, the dampening layer providing electrical isolation to the operational circuitry, the dampening layer comprising a moldable material in direct contact with an inner surface of the canister. Methods of manufacturing such a medical device are also disclosed.

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.