An electronic contact lens contains electrical components connected by an electrical interconnect. The electrical interconnect has a flat body, with electrical conductors running length-wise along the body. The flat body is oriented perpendicular rather than parallel to the inner and outer surfaces of the contact lens to reduce a visible profile of the interconnect, reducing the amount of light blocked from entering the eye. The body has a curvature shaped to conform to the curvature of the contact lens. As examples, the interconnect may be connected with an electrical component using a tab perpendicular to the flat body of the interconnect, or by forming an edge connection with electrical contacts of the component located along an edge of the component, or through one or more exposed vias formed on the component.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

The present invention discloses a light emitting element comprising a printed circuit board and a light emitting diode. The printed circuit board comprises a photosensitive solder resist layer. Materials of the photosensitive solder resist layer comprise a reflective material and at least one of a conductive nanoparticle and a photoluminescent material. The light emitting diode is disposed on the photosensitive solder resist layer of the circuit board, and is electrically connected to the printed circuit board. By adding at least one of the conductive nanoparticle and the photoluminescent material, the light emitting element of the present invention reduces the photodegradation of the solder resist layer, and improves the reflectivity of the photosensitive solder resist layer.

The present disclosure relates to a driving substrate, a manufacturing method, and a micro-LED array substrate light-emitting backlight module. The driving substrate includes a first metal layer, a first high-reflection layer, and a second metal layer stacked in a top-down sequence. The driving substrate, the manufacturing method, and the micro-LED array light emitting backlight module of the present disclosure solve the loss of reflectivity issue caused by the edge forbidden area of the electrode welding pad edge forbidden region. At the same time, the limited reflectivity of traditional coated high-reflective layers (such as white oil) may also be enhanced.

A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

The main technical problem solved by the present disclosure is to provide a circuit board preparation method. The method includes: obtaining a to-be-processed plate comprising an insulating layer, a first copper layer, a second copper layer opposite to the first copper layer, a blind metalized hole, and a first tab facing the blind metalized hole; obtaining a white insulating material; laminating the white insulating material to a surface of the insulating layer, a surface of the first copper layer, a surface of the first tab, and a surface of the second copper layer to form a first white insulating medium layer and a second white insulating medium layer opposite to the first while insulating medium layer; and performing surface polishing for the first white insulating medium layer and grinding the first white insulating medium layer until the first tab is exposed to form a first white reflective layer.

The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

Discussed is a protection circuit module that may include a printed circuit board configured to be connected to a positive lead part and a negative lead part connected to a battery cell, wherein the printed circuit board includes an upper layer bonded to the positive lead part and the negative lead part so as to be electrically connected; an intermediate layer including a first insulating layer including a material containing an epoxy resin and provided below the upper layer; and a laser reflective layer provided between the upper layer and the first insulating layer and reflecting light from a laser.

A lamp contains a carrier for mounting of at least one flat light-emitting electroluminescence diode fitted with at least one cathode electric outlet and at least one anode electric outlet for the connection to electric conductors. The carrier includes a carrier body. The electric conductors comprise a cathode circuit an anode circuit, and contacts for the respective connection of the electric outlets of the electroluminescence diode to the cathode circuit and anode circuit. The cathode circuit or the anode circuit is positioned either completely on a surface of the carrier or at least a part of at least one of the cathode circuit or the anode circuit is positioned inside the carrier body and the remaining part of the circuit is positioned on the carrier surface.

A method for machining a holding device for a light module of a lighting device of a motor vehicle. An SMD semiconductor light source component arranged on the holding device is operated for light generation. An emission characteristic of a light-emitting surface of the SMD semiconductor light source component is determined. A mechanical feature with regard to the holding device is specified depending upon the emission characteristic. An optical element which co-operates optically with the SMD semiconductor light source component is specified depending upon the mechanical feature with regard to the SMD semiconductor light source component.