An electronic contact lens contains electrical components connected by an electrical interconnect. The electrical interconnect has a flat body, with electrical conductors running length-wise along the body. The flat body is oriented perpendicular rather than parallel to the inner and outer surfaces of the contact lens to reduce a visible profile of the interconnect, reducing the amount of light blocked from entering the eye. The body has a curvature shaped to conform to the curvature of the contact lens. As examples, the interconnect may be connected with an electrical component using a tab perpendicular to the flat body of the interconnect, or by forming an edge connection with electrical contacts of the component located along an edge of the component, or through one or more exposed vias formed on the component.

A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

Provided is a substrate having dielectric strength and light reflectivity, as well as excellent mass productivity. A substrate (10) for mounting a light-emitting element (20) thereon includes a base (12) and an insulation layer (30) disposed directly or indirectly on a surface of the base (12). The insulation layer (30) includes a reflection layer (32) that reflects light and a mesh glass sheet 31 that is disposed within the reflection layer (32) and that has a coefficient of linear expansion smaller than that of the reflection layer (32).

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.

A phosphor substrate having at least one light emitting element mounted on one surface, includes an insulating substrate, at least one electrode pair disposed on one surface of the insulating substrate and bonded to the light emitting element, and a phosphor layer disposed on one surface of the insulating substrate, including a phosphor in which a light emission peak wavelength, in a case where light emitted by the element is used as excitation light, is in a visible light region, in which a bonded surface of the electrode pair facing an outer side in a thickness direction of the insulating substrate, the bonded surface being bonded to the light emitting element, is positioned further on the outer side in the thickness direction than a non-bonded surface other than the bonded surface, and at least a part of the phosphor layer is disposed around the bonded surface of the one surface.

A keyswitch device includes a base plate, a membrane circuit board, a light source, and a keyswitch assembly. The membrane circuit board is disposed on the base plate and includes a reflective film layer, a transmissive film layer, and a light guide spacer. The reflective film layer is located on the base plate. The transmissive film layer is located over the reflective film layer. The light guide spacer has an accommodating space. The reflective film layer and the transmissive film layer are respectively located at opposite sides of the light guide spacer. The light source is disposed between the reflective film layer and the transmissive film layer and located in the accommodating space. The keyswitch assembly is disposed on the membrane circuit board.

A phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, and a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, and the insulating substrate contains a bismaleimide resin and glass cloth.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

A circuit board having a high reflectivity includes a wiring board, a first solder resist layer, and a second solder resist layer. The wiring board includes a wiring layer on an outer side, the wiring layer including wiring and a bond pad spaced from the wiring. The first solder resist layer, with opening and groove, covers the wiring layer, the bond pad is exposed from the opening but spaced from the first solder resist layer. The second solder resist layer infills the groove and covers the first solder resist layer but does not make contact with the mounting surface of the bond pad. A method for manufacturing such circuit board is also disclosed.