Patent classifications
H05K2201/2072
ELECTRICAL CONNECTOR FOR CONNECTING ELECTRICAL CONDUCTORS TO A PRINTED CIRCUIT BOARD
The present invention relates an electrical connector (1) for connecting one or more electrical connectors to a board, in particular to a printed circuit board, which comprises at least the following features: a housing (15) which can be electrically connected on a connection side (131) of the electrical connector (1) to an electrical connection part (2) and which comprises, on a contact side (141) of the electrical connector (1), at least one or more contacts (4), in order to electrically contact one or more counter-contacts (31) of the printed circuit board (3), at least one latching peg arrangement (5) which, in the mounted state on the printed circuit board (3), passes through an opening (32) of the printed circuit board (3) and which can be moved from a non-expanded positiona release positioninto an expanded positiona latching position, in which its diameter on the side of the opening (32), which faces away from the housing (15), is greater than the diameter of the opening (32) of the printed circuit board (3), wherein the housing (15) comprises at least one or more actuation device(s) (500) which can be moved relative to the housing (15), and wherein the latching peg arrangement (5) comprises at least two functional elements which are movable relative to one another, of which at least one is arranged on the actuation device (500) and at least another one is arranged on a component of the connector, which is movable relative to the actuation device (500), and wherein the counter-contact(s) is/are designed as contact(s) on the surface of the printed circuit board (FIG. 2).
Display device
A display device includes: a display panel including a bending region; and a flexible printed circuit film connected to the display panel, the display panel including: a substrate; a display active layer on the substrate to display an image; a protection layer on the substrate; and a polarization layer on the display active layer, and the polarization layer includes an inclination part at a side surface thereof, the protection layer covers the bending region, and a side of the protection layer is in contact with the inclination part.
ELECTRODE SUBSTRATE FOR TRANSPARENT LIGHT-EMITTING DEVICE DISPLAY, AND MANUFACTURING METHOD THEREFOR
A method of manufacturing an electrode substrate for a transparent light emitting device display that includes laminating copper foil on a transparent base material; forming a copper foil pattern by etching the copper foil; forming a transparent photosensitive resin composition layer on a front surface of the transparent base material and the copper foil pattern; and exposing at least a part of the copper foil pattern by removing at least a part of the transparent photosensitive resin composition layer provided on the copper foil pattern.
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
A wiring board includes an insulating substrate including a cutout portion that opens in a main surface of the insulating substrate and a side surface of the insulating substrate, an inner surface electrode on an inner surface of the cutout portion, an external electrode on the main surface of the insulating substrate, and a connecting section where the inner surface electrode and the external electrode are connected to each other. The connecting section is thicker than the inner surface electrode and the external electrode.
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
A method of manufacturing a printed circuit board or a subassembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material,
wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties.
Furthermore a printed circuit board (10) or sub-assembly thereof is provided.
3D PRINTING METHOD AND PRODUCT
A product and a method of manufacturing a product are provided, in which a 3D structure (26) is printed over a printed circuit board (20). An adhesion layer (24) is provided between them. One of the interfaces to the adhesion layer (24) comprises a cavity structure (22). This improves adhesion and releases stress build up in the printed circuit board (20).
Method for Manufacturing Shape-Retaining Non-Flat Devices
Methods are provided for manufacturing shape-retaining non-flat devices comprising components integrated on a device surface, the non-flat devices being made by deformation of a flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.
STRETCHABLE CONDUCTIVE CONNECTION-BASED STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Disclosed is a stretchable electronic device, including: a stretchable board having a surface for mounting one or more electric parts; and a stretchable conductive connecting body provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability. The stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.
ELECTRONIC DEVICES INCORPORATING FLEXIBLE COMPONENT LAYERS WITH INTERLOCKING DEVICES
Electronic Devices Incorporating Flexible Component Layers with Interlocking Devices At least some aspects of the present disclosure directs to an electronic device 100 comprising a rigid member 100A, 100B, a flexible component layer 130, and an interlocking device 110A, HOB disposed between the flexible component layer and the rigid member. The flexible component layer has at least two sections when the flexible component layer is flexed. The interlocking device comprises a first interlocking component attached to or integrated with the flexible component layer, and a second interlocking component attached to or integrated with the rigid member configured to engage with the first interlocking component, such that the engagement prevents the separation of the flexible component layer from the rigid member along a direction generally perpendicular to a surface of the rigid member.