An optical module includes: a first substrate with a first surface, the first substrate having some first pads on the first surface; a second substrate with a second surface, the second substrate having some second pads on the second surface, each of the first pads and a corresponding one of the second pads being opposed to each other and constituting an opposed pair of pads; a first insulation wall between an adjacent pair of the first pads, and in contact with the first surface of the first substrate; and a second insulation wall between an adjacent pair of the second pads, and in contact with the second surface of the second substrate. The first insulation wall and the second insulation wall overlap with none of the opposed pair of pads and are adjacent to each other in a direction along the first surface and the second surface.

The present invention discloses a light emitting element comprising a printed circuit board and a light emitting diode. The printed circuit board comprises a photosensitive solder resist layer. Materials of the photosensitive solder resist layer comprise a reflective material and at least one of a conductive nanoparticle and a photoluminescent material. The light emitting diode is disposed on the photosensitive solder resist layer of the circuit board, and is electrically connected to the printed circuit board. By adding at least one of the conductive nanoparticle and the photoluminescent material, the light emitting element of the present invention reduces the photodegradation of the solder resist layer, and improves the reflectivity of the photosensitive solder resist layer.

A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

A circuit board including: an insulation layer having a first surface and a second surface facing each other; a first pad layer including a first connection pad and a first conductive layer stacked on the first connection pad, a portion of the first pad layer buried in the insulation layer, and another portion of the first pad layer protruding from a first surface of the insulation layer; and a second conductive layer disposed on the first conductive layer.

A printed circuit board includes: a first interconnection layer; a first insulating layer covering at least a portion of a side surface of the first interconnection layer; a second insulating layer covering at least a portion of an upper surface of the first interconnection layer and at least a portion of an upper surface of the first insulating layer; a third insulating layer covering at least a portion of a lower surface of the first interconnection layer and at least a portion of a lower surface of the first insulating layer; a second interconnection layer disposed on an upper surface of the second insulating layer; and a third interconnection layer disposed on a lower surface of the third insulating layer.

A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an -hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The -hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.

A method for manufacturing a structured substrate is provided, the method including: forming a plurality of openings extending from a first surface of a substrate towards a second surface of the substrate, wherein the first surface is coplanar to the second surface, wherein the substrate comprises glass, and wherein each of the openings comprises a sidewall; forming a first layer at least on the sidewall of the openings; forming a second layer on the first layer, wherein the second layer comprises titanium; and depositing metal on the second layer to at least partially fill the openings.

A circuit board including a substrate, a first circuit layer, a first insulating layer, a second circuit layer, and a solder resist layer is provided. The first circuit layer is disposed on the substrate. The first insulating layer is disposed on the substrate and covers a portion of the first circuit layer. The second circuit layer is disposed on the first insulating layer and penetrates a portion of the first insulating layer to electrically connect the first circuit layer. The solder resist layer is disposed on the substrate and covers a portion of the second circuit layer.