A printed wiring board includes an uppermost resin insulating layer, an uppermost conductor layer, a solder resist layer, a dam conductor connected to the upper most conductor layer, and a metal dam formed on and connected to the dam conductor. The uppermost conductor layer includes electrodes and a conductor circuit that are positioned to mount an electronic component in a mounting area in the solder resist layer. The metal dam is surrounding the mounting area. The solder resist layer has first openings reaching to the electrodes of the uppermost conductor layer and a second opening reaching to the conductor circuit of the uppermost conductor layer. The dam conductor is formed in the second opening of the solder resist layer. The conductor circuit in the uppermost conductor layer is a ground circuit or power supply circuit such that the conductor circuit is connected to the metal dam via the dam conductor.

A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.

A printed circuit board according to an embodiment includes: a first insulating layer; a first wiring layer buried in the first insulating layer; a first via disposed within a first via hole in the first insulating layer; a second insulating layer disposed below the first insulating layer; a second wiring layer buried in the second insulating layer; a first solder resist layer disposed on the first insulating layer; and a cavity extending along a height direction by penetrating the first solder resist layer and penetrating a portion of the first insulating layer. The cavity includes a first portion, a second portion, and a third portion having different 10 widths. Along the height direction, the first portion is disposed on the second portion and the third portion is disposed on the first portion. The first via is exposed through the second portion of the cavity.

A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.

A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

A disclosed circuit board includes: an insulating layer that has a first surface and a second surface facing each other and includes a trench portion concavely recessed from the first surface of the insulating layer; a first connection pad that is embedded within the insulating layer and is exposed from the first surface of the insulating layer; and a first protective layer that covers the insulating layer and is opened to expose the first connection pad and the trench portion from the first surface of the insulating layer.

A printed circuit board includes a first insulating layer; a first wiring layer buried in the first insulating layer; a first solder resist layer located on the first insulating layer; and a cavity formed along a height direction, penetrating through the first solder resist layer, and penetrating through a portion of the first insulating layer, in which a second depth of an edge portion of the cavity may be greater than a first depth of a central portion of the cavity along the height direction.

A printed circuit board includes: a first interconnection layer; a first insulating layer covering at least a portion of a side surface of the first interconnection layer; a second insulating layer covering at least a portion of an upper surface of the first interconnection layer and at least a portion of an upper surface of the first insulating layer; a third insulating layer covering at least a portion of a lower surface of the first interconnection layer and at least a portion of a lower surface of the first insulating layer; a second interconnection layer disposed on an upper surface of the second insulating layer; and a third interconnection layer disposed on a lower surface of the third insulating layer.

A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part positioned on a surface of the electrical wiring part and including a support substrate and an optical waveguide such that the optical wiring part has a component region configured to position a component on the optical wiring part and the optical waveguide includes a core part and a cladding part. The support substrate in the optical wiring part has a thermal expansion coefficient lower than a thermal expansion coefficient of the optical waveguide and includes a conductor region and a non-conductor region such that the optical waveguide is formed on a surface of the support substrate in the non-conductor region and the optical wiring part includes one or more penetrating conductors penetrating through the support substrate in the conductor region.