A printed circuit board (PCB) structure with heat dissipation function, includes: at least one substrate, which includes a first substrate including a first primer material and a first electronic conductive layer disposed on the first primer material; and a solder mask layer, disposed on the electronic conductive layer; wherein when the at least one substrate includes the first substrate and a second substrate, the PCB structure further includes an adhesive insulation layer connected between the first substrate and the second substrate. At least one of the material compositions of the solder mask layer and the adhesive insulation layer, includes an aluminum oxide-boron nitride-fullerene composite material, to transmit heat from the substrates to the outside of the substrate by radiation heat transfer.

A printed circuit board includes: a plurality of insulating layers; a plurality of wiring pattern layers disposed on at least one surface of the plurality of insulating layers; a via connecting wiring pattern layers, among the plurality of wiring pattern layers, disposed on upper and lower surfaces of one of the plurality of insulating layers to each other; a connection pad disposed on a surface of an outermost layer among the plurality of insulating layers; and a solder resist having a hole exposing at least a portion of the connection pad. An external surface of the solder resist has surface roughness.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, bumps including a first bump and a second bump such that the first bump is formed on the first conductor pad of the conductor layer and that the second bump is formed on the second conductor pad of the conductor layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

An electronic device includes an electronic component and a circuit board. The electronic component has a heat dissipation pad. The circuit board has a heat dissipation land and an over resist. The heat dissipation land is formed to protrude from a surface of the circuit board and receives heat from the heat dissipation pad. The over resist is a solder resist arranged on a surface of the heat dissipation land, so as to cover at least a part of an outer periphery of the heat dissipation land, and a resist opening is formed on the surface of the heat dissipation land.

A camera module according to an embodiment includes a reinforcing plate; a substrate disposed on the reinforcing plate; a lens driving unit disposed on the substrate; and an adhesive layer disposed between the reinforcing plate and the substrate, wherein the substrate includes a first cover layer including a plurality of holes; and a circuit pattern layer disposed on the first cover layer; wherein the adhesive layer is adhered contacts the circuit pattern layer through the plurality of holes.

A printed circuit board includes a glass layer, a first insulating layer disposed on the glass layer, a first interconnection layer disposed on the first insulating layer, and a first protective layer covering a portion of an upper surface of the glass layer, at least a portion of a side surface of the glass layer, and at least a portion of a side surface of the first insulating layer.

A wiring substrate includes a build-up part including a conductor layer and an insulating layer, a solder resist layer formed in contact with a surface of the build-up part, and a metal post formed on the build-up part and protruding from the solder resist layer. The build-up part includes conductor layers including the conductor layer and insulating layers including the insulating layer such that the conductor layer includes a conductor pad, is formed on a surface of the solder resist layer and is in contact with a surface of the insulating layer forming the surface of the build-up part, and the metal post includes a base plating layer connected to the conductor pad of the conductor layer in the build-up part such that the base plating layer includes a penetrating portion formed in an opening of the solder resist layer and a pad portion protruding from the solder resist layer.

A camera module according to an embodiment includes a reinforcing plate; a substrate disposed on the reinforcing plate; a lens driving unit disposed on the substrate; and an adhesive layer disposed between the reinforcing plate and the substrate, wherein the substrate includes a first cover layer including a plurality of holes; and a circuit pattern layer disposed on the first cover layer; wherein the adhesive layer is adhered contacts the circuit pattern layer through the plurality of holes.

A flexible circuit board includes an inner wiring substrate, a first cover film, a second cover film, a first adhesive block, and two outer wiring substrates. The inner wiring substrate includes a dielectric layer, and the dielectric layer includes a first flat portion, a second flat portion, and a foldable portion connecting the first flat portion and the second flat portion. The first cover film is disposed on the first flat portion and located between the first flat portion and the second flat portion. The second cover layer is disposed on the second flat portion and is located between the first flat portion and the second flat portion. The first adhesive block bonds the first cover film and the second cover film, and the inner wiring substrate is located between the two outer wiring substrate. A method for manufacturing the flexible circuit board is also disclosed.

An electronic device is provided. The electronic device includes a housing, a first substrate disposed inside the housing and including at least one first pad, a first layer disposed on the first substrate and including at least one first accommodating portion, an electrical component disposed inside the housing and including at least one second pad positioned corresponding to the at least one first pad, a second layer disposed on the electrical component, stacked on the first layer, and including at least one second accommodating portion, a conductive member configured to electrically connect the at least one first pad and the at least one second pad, and first bonding resin disposed in the at least one first receiving portion and the at least one second receiving portion.