The present invention relates to a batch alignment device for screen printers and a batch alignment method using the same, and can simultaneously, collectively, and quickly align multiple printed circuit boards in multiple alignment holes formed in one alignment jig to enable components to be simplified, the weight of a device to be reduced, production process and time to be shortened, and productivity to be improved and, accordingly, enable mass production, and can quickly implement high-quality printing, which corresponds to the alignment jig and a printing pattern of the mask, on the multiple printed circuit boards, simultaneously with completion of the alignment of the multiple printed circuit boards by aligning only the X-axes and Y-axes on the planes of the printed circuit boards in the alignment jig in a state where a mask and the alignment jig are aligned.

In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.