This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.

The present application provides a method for manufacturing a microelectrode film. The method includes: forming at least one recess on the carrier substrate by isotropic etching; forming a microelectrode seed pattern in the recess; growing a microelectrode in the recess by using the microelectrode seed pattern; making a first substrate to be in contact with a side of the carrier substrate having the recess thereon; separating the microelectrode from the carrier substrate to transfer the microelectrode onto the first substrate.

A component carrier includes a first level stack of first plural of electrically conductive layer structures and/or first electrically insulating layer structures; a first component aligned within a first through hole cut out in the first level stack such that one of an upper or a lower surface of the first component is substantially flush with an respective upper or a lower surface of the first level stack second electrically conductive layer structures and/or second electrically insulating layer structures attached onto the upper and the lower surface of the first level stack thereby covering the first component at the upper and the lower surface of the first component and pressed to form a second level stack. A second component is aligned within a second through hole cut out in the second level stack such that one of upper or a lower surface of the second component is substantially flush with an upper or a lower surface of the second level stack.

A component carrier and a method of manufacturing the component carrier are presented. The component carrier includes a stack having a stack with: i) at least two electrically insulating layer structures; ii) a first electrically conductive layer structure, including a first line spacing, and at least one second electrically conductive layer structure, having a second line spacing embedded in and/or provided on one of the at least two electrically insulating layer structures, respectively; iii) at least one third electrically conductive layer structure, having a third line spacing, provided on and/or in one of the at least two electrically insulating layer structures, wherein the first line spacing and the second line spacing is larger than the third line spacing, wherein the third electrically conductive layer structure is arranged between the first electrically conductive layer structure and the second electrically conductive layer structure in the stacking direction of the stack; and iv) an electrically conductive connection that electrically connects the first electrically conductive layer structure and the second electrically conductive layer structure in the stacking direction, wherein the electrically conductive connection passes through the third electrically conductive layer structure at a connection layer structure.

An optical receiver including a photodetector and a waveguide is provided. The photodetector includes a plurality of photosensitive regions arranged in an array. The waveguide is disposed on the photodetector and includes a plurality of gratings, a plurality of optical channels, and a plurality of light-deflection elements. The gratings are respectively adapted to collect light beams incident on the waveguide at different angles. The optical channels are adapted to propagate the light beams collected by the gratings. The light-deflection elements are disposed on transmission paths of the light beams propagating in the optical channels and are located above the photosensitive regions. The light-deflection elements are adapted to propagate the light beams propagating in the optical channels to the photosensitive regions. An optical transceiver is also provided.

A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

A flexible circuit board and a cutting device are provided. The flexible circuit board includes a board body including a cutting region. A plurality rows of testing terminals are located in the cutting region, a first spacing being provided between two adjacent rows of testing terminals. The testing terminals can be respectively cut off from the board body along a cutting direction which is along the extending direction of the first spacing in the board body. A testing circuit is located on a surface of the board body. The testing circuit is arranged in a region outside the cutting region and the testing circuit is independently and electrically connected to each row of the testing terminals.

A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.

There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.

A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.