In a method for filling through-holes of a substrate with a metal paste, an upper lamination foil is secured to the top surface of the substrate and a lower lamination foil is secured to the bottom surface of the substrate. A laser beam is used to generate a first plurality of holes in the upper lamination foil, and a second plurality of holes in the lower lamination foil. Respective locations of the first and second plurality of holes are aligned with the through-holes of the substrate. Metal paste is applied into the through-holes through the first plurality of holes using a squeegee or a knife. Any metal paste that is pressed out from the second plurality of holes may be scraped off by the squeegee or the knife and recycled. Finally, the upper and lower lamination foils may be removed from the substrate.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

An embedded component structure including a circuit board, an electronic component, a dielectric layer and a connection circuit layer and a manufacturing method thereof is provided. The circuit board has a through hole and includes a core layer, a first circuit layer, and a second circuit layer. The first circuit layer and the second circuit layer are disposed on the core layer. The through hole penetrates the first circuit layer and the core layer. The electronic component including a plurality of connection pads is disposed within the through hole where the dielectric layer is filled in. The Young's modulus of the core layer is greater than the Young's modulus of the dielectric layer. The connection circuit layer covers and contacts a first electrical connection surface of the first circuit layer and at least one of a second electrical connection surface of each of the connection pads. A manufacturing method of an embedded component structure is also provided.

A printed wiring board includes a core substrate including core material and having opening through the core material, first electronic components in the opening each including a first electrode, second electronic components in the opening each including a third electrode, a first build-up layer formed on surface of the substrate and including a first insulating layer, a first conductor layer on the first insulating layer, first via conductors through the first insulating layer and connecting to the first conductor layer, and a third resin insulating layer on the first insulating layer. The first conductor layer includes first conductor circuit formed directly over the opening, and on-core-material first conductor circuit directly over the core material. Groups of the first via conductors connect the first electrodes to the first conductor circuit and the third electrodes to the first conductor circuit. Each first via conductor in the groups has a recessed top portion.

A cleaning system and a cleaning method to clean the paste overflowing from at least one hole on the substrate on to at least one substrate during the production of ceramics sintered together at low temperature. The cleaning system includes at least one adhesive tape that adheres to the paste and is convenient for placing over the substrate and at least one pressing element which presses the adhesive tape towards the substrate in order for the adhesive tape to adhere to the overflowing paste. The cleaning method includes laying at least one adhesive tape over the substrate; pressing the adhesive tape towards the substrate by at least one pressing element and enabling the adhesion of the adhesive tape to the paste overflowing from the hole; and separation of the adhesive tape that adheres on the paste overflowing from the hole.

A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces between the electrical isolator/metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal films on the electrical isolator, the metal posts and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts.

The instant disclosure provides a polyimide composite film for a flexible display and a method for manufacturing the same. The composite film can be attached to a supporting carrier and includes a double-sided tape, a releasing layer and a transparent polyimide film. The double-sided tape includes a substrate, a surface of the substrate has an adhesive disposed thereon, and the other surface of the substrate has a releasing agent disposed thereon. A releasing layer is attached to the adhesive on the substrate and is removable from the substrate so that the substrate is attachable to the supporting carrier through the adhesive. The method includes providing a transparent polyimide film; providing the double-sided tape mentioned above; and removing the releasing layer on the releasing agent of the substrate for adhering the transparent polyimide film to the releasing agent.

Provided is a component mount board which includes: a board having a base, a first conductive pattern, a mount component connected to the first conductive pattern, and a soluble layer; and a second conductive pattern, in which the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid, the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion, the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.

Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.