The present disclosure discloses a vacuum adsorption unit and a vacuum adsorption carrier, wherein the vacuum adsorption unit comprises: a housing defining an air path through-hole therein, the air path through-hole provided with an upper abutting surface and a lower abutting surface; a piston movable provided in the air path through-hole and is located between the upper abutting surface and the lower abutting surface; an outer peripheral wall of the piston is slidably matched with an inner peripheral wall of the air path through-hole; an elastic member having both ends that respectively abut against the housing and the piston, to constantly drive the piston to abut on the upper abutting surface; and a pressure relief passage communicated with the air path through-hole, and is configured to be closed only when the piston moves to abut against the lower abutting surface.

A printed circuit board (PCB) printing method includes obtaining PCB parameters and stencil printing parameters of a PCB to be printed, determining print parameters for printing the PCB according to a print model parameter relationship, the obtained PCB parameters, and standard values of solder paste detection parameters, transmitting the determined print parameters to a printer for printing the PCB, receiving values of the solder paste detection parameters detected by a solder paste inspection device, determining whether the detected values are within a preset range of the standard values, and re-determining the print parameters when the detected values are not within the preset range of the standard values. The print model parameter relationship indicates a relationship of the PCB parameters and the print parameters to solder paste detection parameters. The solder paste detection parameters include information related to solder paste on the printed PCB.

A method to remove slugs from a circuitry pattern on the fly during the fabrication of a flexible printed circuit, the method includes applying a coverlay reel-to-reel onto one side of the metal foil on the fly and applying a sacrificial liner reel-to-reel onto another side of the metal foil on the fly. Then, after the slugs and circuitry patterns are created from laser ablation, the slug can be removed by applying compressed air to the slugs and/or peeling off the sacrificial liner from the circuitry pattern reel-to-reel.

A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board with the sliding rheostat slides along between two bonding pads, includes the following steps: outer layer etching; resin plugging: a. plugging the resinous ink into the pre-plugging position; b: baking, baking on the baking plate of the oven after the plugging is finished; board polishing: using a ceramic brush to process the plugged board, then using a non-woven fabric blush to polish the surface that is polished by ceramic brush. The present invention provides a process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board. The resin plugging method is used to plug the gap between the conductors of the sliding rheostat, so as to prevent the sliding rheostat from being unable to slide due to the altitude difference between conductors of the high-frequency signal board.

A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

A component assembly that includes a connection between two components, in particular an electronic circuit board and a housing. The connection includes a pin-shaped connector via which the electronic circuit board is held on the housing, and the pin-shaped connector in a passage of the housing being connected to the housing via a housing caulking. The pin-shaped connector, in the area of the housing caulking, includes a recess that cooperates with the housing caulking in such a way that the pin-shaped connecting means is held in the passage.

A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.

A stylus for operation with a digitizer device is described. The stylus comprises a housing, at least one transmitter within the housing, electronic circuitry within the housing, the electronic circuitry configured to generate a signal for transmission by the transmitter such that in use, the digitizer device is able to detect the transmitted signal and infer a position of the transmitter with respect to the digitizer device; and an electrically conducting connector. The connector connects the transmitter to the electronic circuitry, and conveys the generated signal from the electronic circuitry to the transmitter. The connector and the transmitter are formed as a single element.