A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.sup.2.

A 3D printed drilling template (20, 30a, 30b, 30c) including: a rigid framework able to be manipulated by an operator or an automaton, and a set of traversing (22, 32a, 32b, 32c, 33c) orifices in the framework and arranged to guide the drilling of holes into a structure on which the drilling template is mounted, wherein the drilling template (20, 30a, 30b, 30c) is designed or revised on an ad-hoc basis and manufactured by 3D printing and using a 3D printing material based on a polymer material mixed with powdered graphene.

A powder gathering apparatus includes at least two rotating plates and a driving mechanism. The at least two rotating plates are disposed with respect to each other. Each of the rotating plates includes at least one spherical member. The at least one spherical member protrudes from the rotating plate. The driving mechanism drives at least one of the at least two rotating plates to move, such that the at least two rotating plates get close to or away from each other. The driving mechanism drives the at least two rotating plates to rotate.

A stylus for operation with a digitizer device is described. The stylus comprises a housing, at least one transmitter within the housing, electronic circuitry within the housing, the electronic circuitry configured to generate a signal for transmission by the transmitter such that in use, the digitizer device is able to detect the transmitted signal and infer a position of the transmitter with respect to the digitizer device; and an electrically conducting connector. The connector connects the transmitter to the electronic circuitry, and conveys the generated signal from the electronic circuitry to the transmitter. The connector and the transmitter are formed as a single element.

A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.

In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.

A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

A PCB (1) has a reinforcing member (12) composed of a material having a higher melting point than a synthetic resin constituting a substrate (10). A first reinforcing member (121) constituting the reinforcing member (12) is composed of a substantially tabular or belt-shaped metal buried in the substrate (10), the metal being at least partially overlapped with an upper surface wire (11). A second reinforcing member (122) constituting the reinforcing member (12) is composed of a substantially columnar metal which is connected to the lower surface of the upper surface wire (11) and physically, chemically or mechanically connected to the first reinforcing member (121), and which vertically extends, in the same manner as a via (111).

To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.