To provide a connected structure of a substrate and an electric wire with high connection reliability even when a carbon nanotube wire with an average diameter of 0.05 mm to 3.00 mm is used as the electric wire. The connected structure of the substrate and the carbon nanotube wire includes a substrate; a carbon nanotube wire made of one or more carbon nanotube aggregates each including a plurality of carbon nanotubes, the carbon nanotube wire having an average diameter of 0.05 mm to 3.00 mm; a conductive fixing member, part of which is provided between the substrate and the carbon nanotube wire; and a conductive member that electrically connects the carbon nanotube wire and the fixing member.

The invention relates to a marking device (02) for marking circuit boards (04) tested by means of a test device (01, 08), wherein the marking device (02) can be fixed to the test device (01, 08) in a defined target position, and wherein the marking device (02) has a marking member (06) which can engage the surface (05) of a circuit board (04), and wherein the marking member (06) can be driven by a drive mechanism (16) in order to apply a marking to the surface (05) of the circuit board (04) by an operating movement of the marking member (06) depending on the test result. The marking device (02) includes a fixation module (10) and a quick change module (11), wherein the marking device (02) can be fixed to the test device (01, 08) in the defined target position by means of the fixation module (10), and wherein the quick change module (11) includes the marking member (06) and the drive mechanism (16), and wherein the quick change module (11) can be replaced without removing the fixation module (10).

A press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a printed circuit board or carrier plate, and method therefor, including a moving unit, which comprises a receptacle for a substrate and with which the substrate can be moved in a plane, which is spanned by an x-axis and a y-axis and can be placed in a press-in position in which one or more components are pressed into the substrate, a lower tool, which comes to rest against the underside of the substrate before or during the press-in, an upper tool, which can be moved against the component for pressing the component along the z axis toward the substrate, a control unit for controlling the moving unit, and a sensor for detecting at least one reference mark present on the substrate, wherein the control unit is configured and designed such that it controls the moving unit depending on the detected reference mark in such a way that the substrate is placed between the lower tool and the upper tool in the press-in position.

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

A supporter for electronic parts includes: an adsorption plate which is attached to an upper surface of a first electronic part among the first electronic part and a second electronic part where the first electronic part and a second electronic part are spaced apart from each other on a plane; and a supporting member which includes 1) a first support part which supports a lower surface of the second electronic part and 2) a connection part which connects the adsorption plate and the first support part. On the plane, about 70-90% of the area of the first support part is overlapped with the second electronic part.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

There is provided a contact structure, comprising a substrate contact including a first contact portion that is located on a leading end side of the substrate contact and that comes into contact with a substrate and a second contact portion that is located nearer to a base end side of the substrate contact than the first contact portion; a seal member configured to cover a periphery of the substrate contact and to have a sealing surface that comes into contact with the substrate to seal the substrate contact; a first pressing portion configured to elastically apply a contact pressure on the substrate to the substrate contact; and a second pressing portion configured to come into contact with the seal member and to apply a contact pressure on the substrate to the seal member independently of the first pressing portion, wherein the first contact portion adheres to the seal member, and the second contact portion is fit in the seal member to be displaceable relative to the seal member.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.