A wiring board includes, a multilayer substrate including a plurality of wiring layers, a plurality of insulating layers, a via hole extending through a subset of the plurality of wiring layers and the plurality of insulating layers, and a screw via embedded in the via hole. The screw via includes a tip portion coupled to first wiring provided in any of the plurality of wiring layers, a core wire having a first end coupled to the tip portion, a head portion coupled to a second end of the core wire and coupled to second wiring located at a surface of the multilayer substrate, and a shank portion formed of an insulator at least on a surface thereof, covering a side surface of the core wire, and having a screw thread on the surface thereof. The tip portion, the core wire and the head portion are formed of a conductor.

A printed circuit board having multiple layers of circuitry, the printed circuit board including a first layer having a first cylindrical opening with a first diameter, the first cylindrical opening formed through at least the first layer and formed about a particular axis; and a second layer having a second cylindrical opening with a second diameter, the second cylindrical opening formed through at least the second layer and formed about the particular axis, where the first cylindrical opening is a portion of a conductive via, and where the second diameter is smaller than the first diameter.

A printed circuit board (PCB) may include a plurality of horizontally disposed signal layers. The PCB may include a first vertically disposed differential via electrically connected to a first horizontally disposed signal layer, of the plurality of horizontally disposed signal layers, and a second horizontally disposed signal layer of the plurality of horizontally disposed signal layers. The PCB may include a second vertically disposed differential via electrically connected to the first signal horizontally disposed layer and the second horizontally disposed signal layer. The PCB may include a first set of clearances encompassing the first vertically disposed differential via and the second vertically disposed differential via, a second set of clearances encompassing the first vertically disposed stub, and a third set of clearances encompassing the second vertically disposed stub.

A bendable printed circuit board is provided. The bendable circuit board may include a circuit board having first and second sections and at least one plated wire that electrically connects and mechanically joins the first and second sections together. The first section may be pivotable with respect to the second section through the at least one plated wire.

A multilayer PCB having may include a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric and conductive layers. A first via hole extends at least partially through the first core structure, wherein an inner surface of the first via hole is plated with a conductive material along a first via segment electrically coupling the first conductive layer to an internal layer or trace within the first core structure. A second via segment extending between the second conductive layer and the internal layer or trace is devoid of the conductive material such that the first via hole is substantially stub free. A first dielectric layer is coupled to the second conductive layer. A second sub-composite core coupled to the first dielectric layer.

The present invention relates to the field of electronic technologies, and discloses a base board and a mobile terminal. The base board includes an electrical pattern and multiple components, the base board further includes a resin layer and a thin resin layer, the component is embedded in the resin layer, and an end face of a foot is flush to a surface of the resin layer; and the thin resin layer is attached to one exposed side of a foot of a component in the resin layer, a through hole corresponding to each foot is disposed in the thin resin layer, the circuit pattern is attached to one side that is of the thin resin layer and that is opposite to the resin layer, and the circuit pattern is connected to a pad that is electrically connected to a foot and that stretches into each through hole.

The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.

Disclosed herein is a method of drilling in a multilayer printed circuit board. The method includes drilling a one hole; directing electromagnetic radiation having at least one wavelength with higher energy than a work-function the metal layer toward the hole, and thus causing the metal layer to emit free electrons; and measuring the quantity or intensity of electrically charged particles derived from the emitted free electrons, to detect the extent of exposure or disappearance of the metal layer during drilling.

A multilayer PCB having may include a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric and conductive layers. A first via hole extends at least partially through the first core structure, wherein an inner surface of the first via hole is plated with a conductive material along a first via segment electrically coupling the first conductive layer to an internal layer or trace within the first core structure. A second via segment extending between the second conductive layer and the internal layer or trace is devoid of the conductive material such that the first via hole is substantially stub free. A first dielectric layer is coupled to the second conductive layer. A second sub-composite core coupled to the first dielectric layer.

Due to size and cost, it becomes advantageous for integrated circuit (IC) manufacturers to use single-ended (one signal path per unique information path) high speed signals electrical contact pins (pins transmitting digital information that connect the integrated circuit to a printed circuit board) with a minimum number of surrounding powers and grounds. This lower cost method, however, creates electrical interference and coupling issues known as crosstalk between two adjacent signal paths in the via structure required to electrically connect the integrated circuit to the signal paths in the printed circuit board. Such crosstalk, in turn, increases jitter, degrades timing, and ultimately reduces the maximum operating speed of the circuit (performance). This disclosure presents a structure using micro-plating, micro-drilling and micro-machining methods that isolates adjacent signals by placing a metal barrier that shunts coupling currents to ground. The micro-drilling methods also reduce the length of adjacent signal paths in a specific signal routing and controlled depth drilling sequence.