A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

A printed circuit board for an electric component contains an electrically insulating substrate which has a surface and at least one electrically conductive conductor track formed within the substrate. The surface of the substrate has a sealing region which is arranged and/or configured such that the sealing region is flat and/or the substrate has a homogenous substrate thickness in the sealing region. An overmolding which adjoins the sealing region is arranged on the surface of the substrate.

A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first clich pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second clich pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

A process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board with the sliding rheostat slides along between two bonding pads, includes the following steps: outer layer etching; resin plugging: a. plugging the resinous ink into the pre-plugging position; b: baking, baking on the baking plate of the oven after the plugging is finished; board polishing: using a ceramic brush to process the plugged board, then using a non-woven fabric blush to polish the surface that is polished by ceramic brush. The present invention provides a process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board. The resin plugging method is used to plug the gap between the conductors of the sliding rheostat, so as to prevent the sliding rheostat from being unable to slide due to the altitude difference between conductors of the high-frequency signal board.

A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

An electronic device module may include: a board; a ground electrode disposed on a first surface of the board; a sealing portion disposed on the first surface of the board; electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion; a first shielding wall connected to the ground electrode and disposed along a side surface of the sealing portion; and a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall.

A board element for board-to-board interconnect formation is provided. An embodiment includes embedding a signal via element in the board element and cutting through respective sections of the board element and the signal via element to expose a new board element edge and an outwardly facing surface of the signal via element.

Disclosed herein area robot, a dust collection device, and a dust collection method. The robot includes a first moving mechanism, a second moving mechanism, a dust collection part, and a dust collection part moving mechanism. The first moving mechanism is disposed on a base body, and moves a workpiece to be cut in a first axis direction. The second moving mechanism is supported on the base body via support portions, and moves a cutting body in a second axis direction orthogonal to the first axis direction. The dust collection part is disposed to face the cutting body, and collects cutting chips generated by the cutting of the workpiece to be cut using the cutting body. The dust collection part moving mechanism moves the dust collection part between a first position close to the workpiece to be cut and a second position remote from the workpiece to be cut.

A semi-finished product for the production of connection systems for electronic components including two groups (A, B) of alternately applied conductive layers and insulating layers, wherein first layers (2, 2) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area.