A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.

An electronic component includes a glass substrate having a glass body and a protruding crystallized portion, the glass body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface to each other, and the first side surface having the crystallized portion; a colored insulation layer on the first side surface; and a through-conductor within the glass body and extending through the top surface and the bottom surface. The crystallized portion extends in a first direction that is parallel to the bottom surface, as viewed from a direction orthogonal to the first side surface. As viewed from the direction orthogonal to the first side surface, at least a portion of the colored insulation layer extends in the first direction and is disposed adjacent to the crystallized portion in a second direction that is orthogonal to the first direction.

A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.

Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.

A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

Disclosed is a printed circuit board having a holder for a battery, wherein the holder includes first and second contacts connected to conductive traces of the printed circuit board and wherein the holder is embodied such that a battery inserted into the holder is clamped so that poles of the battery on opposite end faces of the battery make electrical contact with the first and second contacts. The battery lies clamped between the contacts on a support region of the printed circuit board and is oriented with reference to the printed circuit board so that an imaginary line connecting the poles of the battery is essentially in parallel with the plane of the support region. The printed circuit board has connected with the support region a rigid first section, which is essentially perpendicular to the support region, and wherein the first contact is arranged on the first section.

There is provided a wiring substrate whose mechanical strength, water resistance, humidity resistance, and product yield can be improved. This wiring substrate includes a device region in which a main wiring pattern composed of a metal layer is embedded in an insulating layer; a peripheral region which surrounds a periphery of the device region and in which a dummy wiring pattern composed of a metal layer is embedded in an insulating layer; and an insulating boundary region interposed between the device region and the peripheral region, composed of an insulating layer. The insulating boundary region has a winding shape in which it is possible to draw a virtual straight line alternately traversing the metal layer constituting the dummy wiring pattern and the insulating layer constituting the insulating boundary region, parallel to an inscribed line of at least one side of an outer edge of the device region.

A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core substrate, and the positions of the two laser cut grooves correspond to the printing area; printing a strippable printing ink in the printing area on the core substrate; laminating a build-up board structure on the side surface of the core substrate; and forming two blind routing openings on another side surface of the core substrate, which correspond to the two laser cut grooves in position respectively; removing a cover-opening structure of the core substrate between the two blind routing openings, so as to form a cover-opening opening.

A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.

A lighting device is described. The lighting device includes a support structure, which includes a central mounting face and at least one first lateral mounting face adjacent the central mounting face and forming an included angle with the central mounting face of 60 to 90. The device also includes at least one central light emitting element on the central mounting face and in contact with the support structure and at least one first lateral light emitting element on the first lateral mounting face and in contact with the support structure.