A millimeter wave antenna and a process design of a millimeter wave antenna are provided. The millimeter wave antenna includes a substrate and an antenna attached to the substrate. The substrate includes a first region and a second region. A thickness of the first region is less than a thickness of the second region. The antenna is arranged on the first region. According to the present application, the millimeter wave antenna enables the substrate attached with the antenna to be as thin as possible, such that a medium structure of the first region of the substrate is changed, reducing an energy loss while a millimeter wave is being transmitted.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

A technique that improves productivity of a functional module on which a component is implemented near an edge. A multi-pattern substrate includes wiring substrate parts, and waste substrate parts provided around the wiring substrate parts integrally. And openings are provided in the waste substrate parts in areas that face components implemented near outer circumferences of the wiring substrate parts.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Provided is a frame assembly for fixing a plurality of stacked battery cells. The frame assembly may include: a frame including an upper surface, a first side surface connected to a first end of the upper surface and a second side surface connected to a second end of the upper surface, the frame being configured to enclose the plurality of battery cells; a plurality of first bus bars disposed on the first side surface; a plurality of second bus bars disposed on the second side surface; and a flexible printed circuit board disposed along the upper surface, the first side surface, and the second side surface of the frame, the flexible printed circuit board being configured to sense the plurality of battery cells.

A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.

A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shield layer of the first shield member is covered.