Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.

A process of forming an article utilizes an ultra-thin, removable, catalytic film for Laser Direct Structuring (LDS). The process includes forming a film from a laser-activatable material, the film exhibiting thickness of less than 100 m; applying the film to a black or opaque substrate to form a film-substrate element; applying a laser to the film-substrate element; removing a portion of the film from the film-substrate element; and applying metal plating to a portion of the black or opaque substrate. Removal of the film from the film-substrate element may follow metal plating of the black or opaque substrate. An article formed by the process may be useful in a computer device, electromagnetic interference device, printed circuit, Wi-Fi device, Bluetooth device, GPS device, cellular antenna device, smart phone device, automotive device, medical device, sensor device, RF antenna device, LED device, RFID device, or a component of a cell phone antenna.

A flexible electronic system includes a flexible electronic substrate having a first and second contact pads opposed to each other, one of the first and second contact pads is electrically coupled to a battery. A protective cover is disposed on the flexible electronic substrate. The flexible electronic system further includes a base support fixedly attached to the flexible electronic substrate, the base support having an adhesive surface opposed to the flexible electronic substrate, and a foil having a first portion removably coupled to at least a portion of the adhesive surface and a second portion, wherein the foil configures to permit a removal of the second portion disposed between the first and second contact pads and wherein the removal of the second portion activates the system.

The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.

A component mounting machine includes a feeder device that has a tape feeding mechanism that feeds out a carrier tape that stores components in respective component storage sections, and a tape peeling mechanism that has a tape peeling blade that carries out peeling, and a component transfer device that has a mounting head that holds a suction nozzle, and a head driving mechanism, the component mounting machine further provided with a peeling start determination section of determining whether or not the peeling starts before the suction nozzle starts a suction operation, and a recovery function section of carrying out a recovery operation in which the recovery function section returns the leading end of the carrier tape temporarily to the front of the tape peeling blade and feeds out the carrier tape again in a case where it is determined that peeling is not started.

An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.

The instant disclosure provides a polyimide composite film for a flexible display and a method for manufacturing the same. The composite film can be attached to a supporting carrier and includes a double-sided tape, a releasing layer and a transparent polyimide film. The double-sided tape includes a substrate, a surface of the substrate has an adhesive disposed thereon, and the other surface of the substrate has a releasing agent disposed thereon. A releasing layer is attached to the adhesive on the substrate and is removable from the substrate so that the substrate is attachable to the supporting carrier through the adhesive. The method includes providing a transparent polyimide film; providing the double-sided tape mentioned above; and removing the releasing layer on the releasing agent of the substrate for adhering the transparent polyimide film to the releasing agent.