A wiring board includes: a substrate first elastic modulus including a first surface and second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member second elastic modulus greater than the first elastic modulus and including a first reinforcing part positioned on the first surface side of the substrate or on the second surface side of the substrate and partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate.

Disclosed is an apparatus for fabricating a stretchable electrical circuit, including: a stretching device configured to stretch a mounted stretchable substrate in two different directions; a marking device configured to mark a mark on the stretchable substrate; an image device configured to obtain an image of the stretchable substrate on which a plurality of alignment marks are marked by the marking device; and a control device configured to control the stretching device, the image device, and the marking device. The control device forms a first axis and a second axis using the plurality of alignment marks marked on the image obtained by the image device and marks one point of a surface of the stretchable substrate with coordinates made by the first axis and the second axis using the first axis and the second axis.

A resin film having an aromatic polysulfone as a forming material is provided. The resin film has a thickness of less than 100 μm, and further contains an organic compound having a boiling point no lower than 250° C. and no higher than 400° C. The organic compound is contained in an amount of at least 500 ppm and at most 4000 ppm relative to the mass of the aromatic polysulfone.

A flexible substrate, a method of processing a flexible substrate and a system of processing a flexible substrate. The method of processing the flexible substrate includes: measuring a first expansion volume of the flexible substrate; and applying a first application pressure to the flexible substrate to laminate the flexible substrate on a base substrate; according to a first corresponding relationship between a first pressure applied to the flexible substrate and a compressive expansion volume generated by the flexible substrate in compression and according to the first expansion volume, the first application pressure is selected to allow a second expansion volume of the flexible substrate to at least partially compensate for the first expansion volume.

A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.

A foreign particle removal system for removing a particle from a surface of a fragile object has a tool gripper which grips a particle removal tool. A force sensing device determines a cleaning position of the particle removal tool relative to the surface whereat a threshold force is exerted on the surface, the threshold force being a force that is exerted by the particle removal tool on the surface that would pick up the foreign particle but would not damage the object. The particle removal tool is conveyed over a location of the foreign particle and is moved towards the surface to the cleaning position whereat the threshold force is exerted on the surface. The particle removal tool is then lifted away from the surface together with the foreign particle.

A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.

Disclosed is an apparatus for fabricating a stretchable electrical circuit, including: a stretching device configured to stretch a mounted stretchable substrate in two different directions; a marking device configured to mark a mark on the stretchable substrate; an image device configured to obtain an image of the stretchable substrate on which a plurality of alignment marks are marked by the marking device; and a control device configured to control the stretching device, the image device, and the marking device. The control device forms a first axis and a second axis using the plurality of alignment marks marked on the image obtained by the image device and marks one point of a surface of the stretchable substrate with coordinates made by the first axis and the second axis using the first axis and the second axis.

A foreign particle removal system for removing a particle from a surface of a fragile object has a tool gripper which grips a particle removal tool. A force sensing device determines a cleaning position of the particle removal tool relative to the surface whereat a threshold force is exerted on the surface, the threshold force being a force that is exerted by the particle removal tool on the surface that would pick up the foreign particle but would not damage the object. The particle removal tool is conveyed over a location of the foreign particle and is moved towards the surface to the cleaning position whereat the threshold force is exerted on the surface. The particle removal tool is then lifted away from the surface together with the foreign particle.

Disclosed herein are a method of fabricating a stretchable electrical circuit and an apparatus for fabricating a stretchable electrical circuit, wherein the method of fabricating a stretchable electrical circuit includes stretching a stretchable substrate, forming a plurality of alignment marks on a surface of the stretchable substrate, forming a first axis extending from a line connecting two alignment marks among the plurality of alignment marks, and a second axis perpendicular to the first axis, marking one point of the surface of the stretched stretchable substrate with coordinates made by the first axis and the second axis, and disposing electrical components using the coordinates.