A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

A process for ultrasonically consolidating particulates in an ink onto a substrate at ambient temperatures in less than 5 seconds to form a completely dense, well adhered functional coatings is disclosed. The coating can be used for electronic components. The process is applicable to various substrates such as metals, plastics and ceramics.

A bonding tool that executes an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire from a direct contact tip portion and a pair of press mechanisms having a pair of press rollers capable of performing a rotational operation. The pair of press mechanisms executes a press processing of pressing both sides of the application portion on the lead wire by the pair of press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool and a movement processing of executing a rotational operation performed by the pair of press rollers to move the pair of press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.

A method for assembling components includes assembling a first component including solder bumps with a second component including connectors. The assembly of the components is preceded by pre-treating the first and second components wherein the solder bumps are contacted with a pre-treatment liquid configured to at least partially remove an oxide layer initially present on the solder. The pre-treatment liquid is an aqueous solution containing carboxylic acids or polycarboxylic acids. The assembly of the components is carried out after the pre-treatment in the absence of liquid or gas flux.