A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration.

Embodiments include a microelectronic package structure having a substrate with one or more substrate pads on a first side of the package substrate. A ball interconnect structure is on the substrate pad, the ball interconnect structure comprising at least 99.0 percent gold. A discrete component having two or more component terminals is on the ball interconnect structure.

A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

An endoscope includes an image pickup unit at a distal end portion of an insertion portion, the image pickup unit includes a chip part provided with a first electrode pad and a second electrode pad, an image pickup device provided with a third electrode pad and a wiring board including a flying lead, the flying lead is inserted into a gap between the chip part and the image pickup device, the first electrode pad and the flying lead are bonded together via a first bump, a bonded portion between the first electrode pad and the flying lead is sealed with first sealing resin, the second electrode pad and the third electrode pad are bonded together via a second bump which is higher than the first bump and sealed with second sealing resin having a Young's modulus lower than a Young's modulus of the first sealing resin.

A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.

A light radiation emitting device including at least one LED-type device capable of generating a light radiation in a predefined wavelength range and having two electrical contact pads, and a support delimited by first and second opposite sides defining together a thickness of the support, the support supporting at least one LED luminous device and at least one conductive electric track. The electric track is formed of conductive wires. All or part of the conductive wires are bonded to the support along all or part of their length. All or part of the conductive wires have at least one contact portion exposed towards at least one of the first and second sides of the support. Each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to the contact portion.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.