A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.

A component mounting device includes: a holding body, pressing mechanism to press the holding body to move on a given route, position detector to detect a position of the holding body, and controller to control the mechanism. The route including: a start position of the holding body at which an insertion pin held by the body is separated from an insertion hole of a substrate, a first position range wherein the insertion pin is partially inserted, and a section position range wherein the insertion pin is fully inserted. When the holding body is pressed by a first pressing force to move on the given route from the start position toward the second position range, the controller controls the pressing mechanism to press the holding body by a pressing force different from the first pressing force, when the holding body stops at a position before or within the first position range.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

A method for gapping a magnetic component is disclosed. The method includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material to wrap the permeability material between the first conductive pattern and the second conductive pattern to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

To provide a technology capable of improving efficiency in a mounting process of disposing a large number of identical parts such as LED elements on a circuit board. An optical light emitting device includes: packages of a plurality of regular polyhedra each having a light emitting element; and a board having a plurality of mounting holes fitted with three surfaces of the regular polyhedral packages. In the optical light emitting device, the exterior of each of the regular polyhedra in the regular polyhedral packages is comprised of a transparent member. Each of the regular polyhedral packages includes: first electrodes each provided at each top; and second electrodes each provided on a straight line connecting the two tops, each of the first electrodes is connected to one electrode of the light emitting element, and each of the second electrodes is connected to the other electrode of the light emitting element.

A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.