A printed circuit board includes a circuit substrate and a plurality of buffering circuits. The circuit substrate includes a substrate layer, and first and second circuit layers formed on either side of the substrate layer. The first circuit layer comprises a plurality of first conductive circuits. The second circuit layer comprises a plurality of second conductive circuits. A line width of each of the plurality of first conductive circuits is greater than a line width of each of the plurality of second conductive circuits. The plurality of buffering circuits electrically connect the first circuit layer to the second circuit layer and a line width of each of the plurality of buffering circuits is greater than the line width of each of the plurality of second conductive circuits.

A wiring substrate includes a metal plate in which at least one wiring formation region is defined, a cavity formed in the wiring formation region, a concave part formed to have a frame shape at a peripheral edge portion of a bottom portion of the cavity, a first pad disposed at a central portion of the bottom portion of the cavity, a wiring portion connected to the first pad and disposed on and extended along the central portion of the bottom portion of the cavity, a side surface of the concave part and a bottom surface of the concave part, and a multi-layered wiring layer disposed at the central portion of the bottom portion of the cavity so as to cover the first pad and a part of the wiring portion. The multi-layered wiring layer has a second pad provided at an upper surface-side and connected to the wiring portion.

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

Disclosed is a circuit board including: an insulation layer for burying at least one wire layer and at least one via layer and having a first side and a second side facing each other, and a first wire layer partly protruding over the first side of the insulation layer and partly buried in the insulation layer, wherein the insulation layer has a concave cavity dented from the first side, and part of the via layer is exposed from the insulation layer through a bottom side of the cavity.

Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductive layer and the intermediate layer. After the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer. The intermediate layer before the etching includes a portion overlapping the second conductive layer in a vertical direction and another portion not overlapping the second conductive layer in the vertical direction.

An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.

A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.