Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

[Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure. [Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure. In addition, the upper surface side interlayer circuit 12 and the lower surface side interlayer circuit 13 can be disposed at misaligned positions in the plane direction of the printed circuit board, and thus the degree of freedom in circuit design increases. Plane circuits 24 and 16 not connected to the first circuit can be disposed with insulating layers 31 and 32 sandwiched below the upper surface side interlayer circuit 12 or above the lower surface side interlayer circuit 13.

Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.

A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.

A method of fabricating a printed circuit board (PCB) including selectively etching copper foil at mapped areas corresponding to predefined radio-frequency (RF) signal performance of a device, for instance an active electrically scanned array (AESA). In embodiments, first and second RF performance areas of a device are mapped, the copper foil is etched at surface portions corresponding to the first RF performance areas to increase surface roughness, and the copper foil is bonded to a substate such that etched portions are aligned with the first RF performance areas of the PCB. In embodiments, the signal performance in the first RF performance areas is greater than the signal performance in the second RF performance areas.

A resistor-embedded circuit board and a method for processing the resistor-embedded circuit board are provided by the present disclosure. By opening an embedded-resistor cavity on a substrate, embedding a resistor into the embedded-resistor cavity to acquire a circuit board containing a built-in resistor. By opening the embedded-resistor cavity, it is very easy to realize high-precision control of a shape and a thickness of an embedded resistor, and realize very high-precision resistor-embedding; and it is easy to realize high-precision and massive processing. In a resistor-embedded layer, a resistor is built in a substrate. Then, in a process of pressing, a crack and a relatively large deformation will not be caused after pressing due to an irregular surface of the resistor-embedded layer, thereby improving a reliability and a quality rate of the circuit board.

Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.

An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.