A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.

A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved.

A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad which is further to carry on surface treatment on the at least one welding pad to form a protective layer; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate.

Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, ranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

A method for manufacturing connection structure, the method includes arranging a first composite on a first surface of a first member where a first electrode is located and arranging conductive particles on the first electrode, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate. An embedded flexible circuit board made by the method is also provided.

A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved.

A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 ?m.