A motor base assembly for a storage drive assembly includes a basewall and a plurality of sidewalls extending from the basewall to define an interior of the motor base assembly. The motor base assembly also includes a stiffener support portion disposed within the interior of the motor base assembly. The stiffener support portion includes a stiffener guide slot and a hole adjacent to the stiffener guide slot. The stiffener guide slot is configured to hold a first plate section of a second stiffener region of a flexible printed circuit and the hole is configured to guide a first stiffener region of the flexible printed circuit.

A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

A manufacturing method of a circuit board and a piezochromic stamp are provided. A circuit pattern is formed on a dielectric substrate. A dielectric layer having a hole or a conductive via and covering the circuit pattern is formed on the dielectric substrate. A conductive seed layer is formed on the dielectric layer. A photoresist layer is formed on the conductive seed layer. A piezochromic stamp is imprinted on the photoresist layer, wherein when the pressing side of the piezochromic stamp is in contact with the conductive seed layer, the light transmittance effect thereof is changed to blocking or allowing light having a specific wavelength to pass through. A patterned photoresist layer is formed by using the piezochromic stamp as a mask. A patterned metal layer is formed on the exposed conductive seed layer. The patterned photoresist layer and the conductive seed layer are removed.

A phosphor substrate of the present invention is a phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by light emitting element is used as excitation light, is in a visible light region, and a second electrode group which is disposed on the other surface of the insulating substrate and includes a plurality of electrodes.

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

A flexible printed circuit for a storage drive assembly is provided. The flexible printed circuit includes a stiffener layer having a first stiffener region, and a second stiffener region separated from the first stiffener region by a hinge region, a first insulation layer disposed on the stiffener layer, a conductive electrode layer disposed on the first insulation layer; and a second insulation layer disposed on the conductive electrode layer, wherein the hinge region is formed from the first insulation layer, the conductive electrode layer and the second insulation layer.

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.