An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body.

An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body.

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm.sup.2 at 220 C. for 2 hours.

The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer while interposing a second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

A component carrier with a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, a cavity formed in the stack and delimited by a bottom wall and a sidewall, and an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall.

A circuit board may include an insulating layer having a first insulating layer part, a second insulating layer part stacked on the first insulating layer part, and a cavity penetrating a portion of the second insulating layer part and the first insulating layer part, a circuit layer at least partially buried in the second insulating layer part; and a metal pattern layer disposed along the edge of the cavity in the second insulating layer part. The insulating layer has a first surface configuring a bottom surface of the cavity and a second surface configuring a side surface of the cavity, and the metal pattern layer comprises a plurality of metal layers exposed from the insulating layer on the second surface and including different metal.