There is provided a method for implementing an electronic card. The method can include providing the electronic card with a printed circuit board. The method further includes selecting one of a first side and a second side as a specified side on which only connection hardware is to be mounted. The first side is located at a first x-y plane and the second side is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB. The first and second x-y planes are parallel.

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

A method includes positioning an integrated circuit package in a coining apparatus having a fixture and a pressing plate. The integrated circuit package includes a substrate, an integrated circuit device disposed on a top surface of the substrate, and a plurality of solder balls disposed on a bottom surface of the integrated circuit package. The fixture includes a support structure and a cavity. The cavity receives the integrated circuit device while the support structure supports portions of a top surface of the integrated circuit package. The pressing plate is pressed against two or more of the solder balls, coining the two or more solder balls until each solder ball has a desired coined surface profile.

A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.

A printed circuit board connector for orthogonal mating of two or more printed circuit boards. The connector utilizes interior perimeter trace connections of a main printed circuit board and internal trace connections of a mating printed circuit board in conjunction with external trace connections. The main board may utilize surface connections, where both external trace connections and internal trace connections are exposed on a surface of the main board to couple to the mating board. The main board may include a slot or pocket, allowing for the partial insertion of the mating board into the main board, with internal trace connections disposed within the slot or pocket. The slot or pocket may extend through the main board, such that the internal trace connections are disposed along a side of the pocket to couple with corresponding internal trace connections of the mating board.

Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass % of a solid solvent having a melting point of 60° C. or less, 50-80 mass % of a solvent, 5-10 mass % of an organic acid, 10-30 mass % of an amine, and 0-5 mass % of a halide, the flux forming a liquid having a high viscosity of 5 Pa.Math.s or higher at 25° C., and forming a liquid having a low viscosity of 50 mPa.Math.s or less at 100° C.

The present disclosure relates to a chip, a circuit board and an electronic device. The chip includes a chip substrate and a plurality of pads arrayed on the chip substrate. At least one of the plurality of pads on the chip is a polygonal pad.

solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.

A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.

The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.