Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.

An electronic device includes a circuit board and an electronic element. The circuit board includes a plate body and multiple through holes extending through the plate body. Each of the through holes has a first diameter. The electronic element includes multiple pins, each of which is inserted into a respective one of the through holes, is secured to the circuit board by a soldering process, and has a second diameter smaller than the first diameter of the respective one of the through holes. For each of the pins, a difference between the second diameter of the pin and the first diameter of the respective one of the through holes ranges from 0.4 mm to 0.6 mm. A method for manufacturing the electronic device is also provided.

Reel for the purpose of winding a length of cable of optical fiber cable type, comprising: a winding support (12) for winding the length of cable; retaining means suitable for retaining the length of cable wound around the winding support; first attachment means for the purpose of attaching the reel to an edge of a circuit board (50) such that the reel is positioned laterally with respect to the circuit board; second attachment means for the purpose of attaching the reel flat to a face of the circuit board.

System comprising a circuit board and a reel.

Method for assembling an electrical device.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

The present disclosure provides a manufacturing method. According to this manufacturing method, either a first claw or a second claw is inserted through a notch formed by notching an edge of the hole. The first claw and the second claw are so provided as to project outward from a wall portion of a cover member that covers the body portion of the component from a soldering surface side. The cover member is held on the wiring board, by sliding the cover member relative to the wiring board in a direction along a component mounting surface of the wiring board to position the edge of the hole between the first claw and the second claw provided on a surface of the wall portion identical to a surface on which the first claw is provided. The body portion is inserted into the hole, and an electrode terminal of the body portion is disposed on the wiring board. Solder is applied by flow soldering to the wiring board on which the cover member is held. The cover member is detached from the wiring board, by sliding the cover member relative to the wiring board to which solder has been applied to shift the first claw from the component mounting surface side to the soldering surface side with the first claw passing through the notch.

A substrate on which an electronic component is soldered, includes an electronic component, a through hole positioned on the substrate and passing through the substrate, a solder that joins the through hole and a terminal of the electronic component inserted in the through hole, a pattern formed on a first surface of the substrate, the first surface facing a second surface on which the electronic component is placed, a first resist superimposed on the pattern, an exposed portion of which the pattern is exposed from the first resist around the through hole, and a second resist superimposed on the pattern and arranged between the through hole and the exposed portion.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.