A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second solder pot is further configured to rotate about a solder pot axis extending transverse to the movement plane. The first solder pot and the second solder pot can be moved relative to the at least one printed circuit board, and at least one of the first solder pot and the second solder pot can be rotated about its solder pot axis relative to the at least one printed circuit board, to simultaneously process the at least one printed circuit board using both solder pots. The soldering system may thus be used to process either a single printed circuit board with both solder pots simultaneously or a pair of printed circuit boards simultaneously with each solder pot processing one of the pair of printed circuit boards. A corresponding soldering method is also disclosed.

A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.

A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second solder pot is further configured to rotate about a solder pot axis extending transverse to the movement plane. The first solder pot and the second solder pot can be moved relative to the at least one printed circuit board, and at least one of the first solder pot and the second solder pot can be rotated about its solder pot axis relative to the at least one printed circuit board, to simultaneously process the at least one printed circuit board using both solder pots. The soldering system may thus be used to process either a single printed circuit board with both solder pots simultaneously or a pair of printed circuit boards simultaneously with each solder pot processing one of the pair of printed circuit boards. A corresponding soldering method is also disclosed.

An electronic device including at least one printed circuit board and at least one electrical or electronic component. The printed circuit board has an assembly side and an opposite soldering side and includes at least one clearance opening, which corresponds to the at least one component and passes through the printed circuit board in the direction of its thickness. The at least one component adjoins the clearance opening and protrudes into it, and therefore the component is exposed from the soldering side and can be cooled by means of a cooling device facing the soldering side.