The invention relates to a printed circuit board (1) with at least two connection points (3) and at least one precision resistor (2) for measuring a current flowing between the connection points. The aim of the invention is to inexpensively produce a printed circuit board of the type mentioned in the introduction such that the printed circuit board has a reduced installation space while simultaneously having a preferably long service life. According to the invention, this is achieved in that the precision resistor extends between the connection points in the printed circuit board (11). The invention additionally relates to a corresponding method for producing said printed circuit board.

An electrical connection between the backplane and the light-transmissive front electrode of an electro-optic display is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

Electrical connection between the backplane and the front electrode of an electro-optic display is provided by forming a front plane laminate (100) comprising, in order, a light-transmissive electrically-conductive layer (104), a layer of electro-optic material (106), and a layer of lamination adhesive (108); forming an aperture (114) through all three layers of the front plane laminate (100); and introducing a flowable, electrically-conductive material (118) into the aperture (114), the flowable, electrically-conductive material being in electrical contact with the light-transmissive electrically-conductive layer (104) and extending through the adhesive layer (108).

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

A connection method for a chip and a circuit board includes: placing the circuit board on the chip, the circuit board having a first surface in contact with the chip having a plurality of contacts, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively; placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively; covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other. The portions of the conductive adhesive that fill the plurality of through holes remain to provide an electrical connection between the circuit board and the chip.