The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

An improved solder column, having a solder core comprising a solder core material, an exoskeleton sleeve structure surrounding at least a majority of an outside surface of the solder core and comprising a plurality of wires woven together to form a mesh, and a plurality of spaces formed in the exoskeleton between the plurality of wires. The exoskeleton sleeve can be configured such that the exoskeleton sleeve will support the solder core so as to prevent a collapse of the solder core at temperatures exceeding a liquidus temperature of the solder core. Optionally, each of the plurality of spaces can have a width and a height that is at least as large as a width of the wire adjacent to the space, and the spaces can be configured to provide additional flexibility to the solder column.

An electronic module includes a first wiring component, a first electronic component, a first bonding member, and a second bonding member. The first wiring component includes a first pad, a second pad, and a first insulating member. The first pad, the second pad, and the first insulating member are formed in a first mounting surface. The first electronic component includes a first electrode and a second electrode and is surface-mounted on the first mounting surface. The first bonding member is configured to bond the first pad and the first electrode together. The second bonding member is configured to bond the second pad and the second electrode together. The first electrode and the second electrode are positioned on an insulating area of the first mounting surface. A distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.

A pane, includes a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of the at least one electrical connection element on the solder material, wherein the at least two soldering points form at least one contact surface between the at least one electrical connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle of at least 90.

The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.

A connecting arrangement. The connecting arrangement includes at least a first connecting partner and a second connecting partner, which are connected integrally together using a solidified solder layer, arranged between the connecting partners, with a solder layer thickness. Each connecting partner has a solder connection surface, which are wettable by the solder material in a molten state. The solder connection surfaces are arranged one above the other and face one another so that both are each contacted at least regionally by the solidified solder layer. Each solder connection surface is configured such that a perpendicular projection of both solder connection surfaces onto one another has at least one definable projection area with mutually overlapping solder connection surface parts. The definable projection area has a peripherally closed edge with at least one contained first cohesive projection sub-area, which is directly adjoined by at least one or more further projection sub-areas.

A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91Dl/De1.09.

The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.

A connection structure includes: a wiring board including a plurality of first electrodes that are arranged on a principal surface; a molded interconnect device (MID) made of a non-electroconductive resin as a base material, the MID including a side surface and a bottom surface, the bottom surface being parallel to the principal surface of the wiring board and including a plurality of arranged second electrodes, and the side surface being perpendicular to the principal surface of the wiring board; and a plurality of electroconductive members each made of an electroconductive paste, each of the electroconductive members electrically connecting each of the plurality of first electrodes to each of the plurality of second electrodes, in which the plurality of electroconductive members are housed in respective reservoir sections formed by the second member and are not in contact with the non-electroconductive resin.

An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.