An embodiment method includes analyzing warpage characteristics of a first package component and a second package component and forming a plurality of solder paste elements on the first package component. A volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component. The method further includes aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component and bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.

An embodiment method includes analyzing warpage characteristics of a first package component and a second package component and forming a plurality of solder paste elements on the first package component. A volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component. The method further includes aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component and bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.

A printed circuit board (PCB) includes a connection area and a trace extending from the connection area. A solder barrier is provided on at least a portion of the trace. The solder barrier is used in lieu of a solder mask. The solder barrier is formed by a laser oxidation process or a laser ablation process, which alters a material property of the trace. Altering the material property of the trace causes the altered portion of the trace to be non-solderable, but does not negatively impact the speed or reliability of signal transmission along the trace.

An electronic module includes a first wiring component, a first electronic component, a first bonding member, and a second bonding member. The first wiring component includes a first pad, a second pad, and a first insulating member. The first pad, the second pad, and the first insulating member are formed in a first mounting surface. The first electronic component includes a first electrode and a second electrode and is surface-mounted on the first mounting surface. The first bonding member is configured to bond the first pad and the first electrode together. The second bonding member is configured to bond the second pad and the second electrode together. The first electrode and the second electrode are positioned on an insulating area of the first mounting surface. A distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.

A circuit board includes an insulating layer that is layered on a substrate; and a dam member in a form of a rectangular frame that is formed on the insulating layer. A corner part of the dam member includes a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer; and a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer.