In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.

Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.

A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91Dl/De1.09.

The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.

A method for enabling self-aligning light-emitting diodes is provided. The method includes printing a die architecture including solders having a bond line thickness according to a printed circuit board design and placing light-emitting diodes in corresponding placement positions onto the solders. The method includes implementing a reflow process that includes a self-alignment effect for the light-emitting diodes. The self-alignment effect comprises creating surface tension forces while the solders are molten that pull or hold the light-emitting diodes to or at final positions.

An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.

A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

Ball grid assembly (BGA) bumping solder is formed on the back side of a laminate panel within a patterned temporary resist. Processes such as singulation and flip chip module assembly are conducted following BGA bumping with the temporary resist in place. The resist is removed from the back side of the singulated laminate panel prior to card assembly. Stand-off elements having relatively high melting points can be incorporated on the BGA side of the laminate panel to ensure a minimum assembly solder collapse height. Alignment assemblies are formed on the socket-facing side of an LGA module using elements having relatively high melting points and injected solder.

A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.