A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer and a second patterned solder-resist layer. The dielectric layer includes a first surface and a second surface, and the first surface has a plurality of recesses. The metal foil is disposed on the second surface. The patterned metal layer is disposed on the first surface, the patterned metal layer has a plurality of openings, and the openings are respectively corresponding to and expose the recesses. The first patterned solder-resist layer is filled in each of the recesses and corresponding to each of the openings. A top surface of the first patterned solder-resist layer is substantially coplanar with a top surface of the patterned metal layer. The second patterned solder-resist layer is disposed on the first patterned solder-resist layer and in the openings, and covers a portion of the patterned metal layer.

Controlling dimensions of nanowires includes lithographically forming a trench in a layer of a polymer resin with a width less than one micrometer where the polymer resin has a thickness less than one micrometer and is deposited over an electrically conductive substrate, depositing a nanowire material within the trench to form a nanowire, and obtaining the nanowire from the trench with a removal mechanism.

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided. A compound is represented by general formula (1): where R.sub.f represents an alkyl group at least part of which is substituted with fluorine, R.sub.O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R.sub.A represents an alkyl group, and R.sub.B represents an alkyl group or a hydrogen atom. ##STR00001##

Some example forms relate to an electronic package. The electronic package includes a first dielectric layer that includes an electrical trace formed on a surface of the first dielectric layer and a second dielectric layer on the surface of the first dielectric layer. The second dielectric layer includes an opening. The electrical trace is within the opening. The electronic package includes an electrical interconnect that fills the opening and extends above an upper surface of the second dielectric layer such that the electrically interconnect is electrically connected to the electrical trace on the first dielectric layer.

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.

The present disclosure provides a method for preparing a metal mesh and a method for preparing an antenna, and belongs to the technical field of electronic devices. The method for preparing a metal mesh of the present disclosure includes: providing a base substrate; and forming a dielectric layer on the base substrate, and performing dry etching on the dielectric layer by an inductively coupled plasma device to form a meshed groove.

A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a dye, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.

A photosensitive resin composition, containing: a binder polymer (A); a photopolymerizable compound (B) having at least one ethylenically unsaturated bond; and a photopolymerization initiator (C), in which the photopolymerization initiator (C) includes an oxime ester-based photopolymerization initiator, and a content of the oxime ester-based photopolymerization initiator is 0.3 parts by mass or more, with respect to a total of 100 parts by mass of the binder polymer (A) and the photopolymerizable compound (B).

A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe.sup.+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.